WAFER-SHAPED OPTICAL APPARATUS AND MANUFACTURING METHOD THEREOF, ELECTRONIC ELEMENT WAFER MODULE, SENSOR WAFER MODULE, ELECTRONIC ELEMENT MODULE,SENSOR MODULE, AND ELECTRONIC INFORMATION DEVICE

• US 20110096213A1
• Filed: 03/18/2009
• Published: 04/28/2011
• Est. Priority Date: 03/21/2008
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hasegawa, Masahiro
• Application Number:
  US12/736,175
• Publication Number:
  US 20110096213A1
• Time in Patent Office: Days
• US Class Current: 348/294
• CPC Class Codes: G02B 13/0035 having three lenses
• CPC Class Codes: G02B 13/0085 employing wafer level optics
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 428/24777 Edge feature

Abstract

A single material is used for an optical member, such as a lens, to obtain high optical accuracy. A glass substrate with a plurality of holes is used as a base material (framework), and overall resin contraction occurred during manufacturing is restrained and a wafer-shaped lens module having a plurality of resin lenses with high dimensional accuracy can be formed. Further, variation in the thickness of the glass substrate is absorbed by lens resin formed on the glass substrate, and the thickness of a flange section can be controlled accurately and variation between resin lenses can also be controlled accurately when layered. Further, a lens portion of the resin lens is made only of a single lens resin, and the refractive index can be maintained even, the designing can be facilitated, and the thickness can be controlled accurately to manufacture a condensing lens with high accuracy.

Claims

1. A wafer-shaped optical apparatus, comprising:

a base material substrate with one or a plurality of holes provided therein;

a resin optical element section provided in each hole of the base material substrate; and

a flange section provided in a peripheral position of the optical element section on the base material substrate.

2. A wafer-shaped optical apparatus according to claim 1, wherein the base material substrate is a glass substrate.

3. A wafer-shaped optical apparatus according to claim 1, wherein a light shielding film is provided on a surface of the base material substrate.

4. A wafer-shaped optical apparatus according to claim 3, wherein the light shielding film has a two layered structure of a light shielding chromium plating and a low reflection chromium plating as a base layer of the light shielding chromium plating.

5. A wafer-shaped optical apparatus according to claim 1, wherein the optical element section is any of a lens, a mirror optical element, a waveguide section, a prism or a hologram element.

6. A wafer-shaped optical apparatus according to claim 1, wherein the flange section is constituted of at least the base material substrate among the base material substrate and a resin material identical to the optical element section.

7. A wafer-shaped optical apparatus according to claim 1 or 6, wherein in the flange section, a resin material identical to that of the optical element section is arranged in a film shape on at least one of an upper surface and a lower surface of the base material substrate.

8. A wafer-shaped optical apparatus according to claim 1 or 6, wherein the flange section is constituted of only the base material substrate.

9. A wafer-shaped optical apparatus according to claim 1, wherein the hole is in any shape of a circle, an ellipse, a rectangle, or a polygon.

10. A wafer-shaped optical apparatus according to claim 1, wherein a resin material of the optical element section is a thermosetting resin material or a photo-curable resin.

18. An electronic element wafer module, comprising:

an electronic element wafer including, arranged therein, a plurality of electronic elements each with through electrodes;

a resin adhesive layer formed in a predetermined region on the electronic element wafer;

a transparent cover member covering the electronic element wafer and fixed on the resin adhesive layer; and

one or a plurality of layered wafer-shaped optical apparatuses according to claim 1 adhered and fixed on the transparent cover member in such a manner to correspond to the plurality of electronic elements respectively.

19. An electronic element wafer module according to claim 18, wherein the electronic element is an image capturing element having a plurality of light receiving sections for performing a photoelectric conversion on and capturing an image of image light from a subject.

20. An electronic element wafer module according to claim 18, wherein the electronic element includes a light emitting element for generating output light and a light receiving element for receiving incident light.

21. An electronic element module obtained by cutting the electronic element wafer module according to claim 18 for each one or plurality of the electronic element modules.

22. A sensor wafer module, comprising:

a sensor wafer including, arranged therein, a plurality of sensor chip sections with through electrodes;

a resin adhesive layer formed in a predetermined region on the sensor wafer;

a transparent cover member covering the sensor wafer and fixed on the resin adhesive layer; and

one or a plurality of lens modules, as the wafer-shaped optical apparatus according to claim 1, mounted on the transparent cover member to be adhered and fixed thereon in such a manner to correspond to a plurality of image capturing elements respectively,

wherein each of the plurality of sensor chip sections includes therein an image capturing element having a plurality of light receiving sections for performing a photoelectric conversion on and capturing an image of image light from a subject.

23. A sensor module obtained by cutting the sensor wafer module according to claim 22 for each one or plurality of the sensor modules.

24. An electronic information device including an electronic element module, as a sensor module, used in an image capturing section thereof, the electronic element module being cut from the electronic element wafer module according to claim 19.

25. An electronic information device including an electronic element module used in an information recording and reproducing section thereof, the electronic element module being cut from the electronic element wafer module according to claim 20.

11. A method for manufacturing a wafer-shaped optical apparatus with a base material substrate as a framework and a resin optical element section being molded at a hole of the base material substrate, the method comprising:

a hole forming step of forming one or a plurality of holes in the base material substrate;

a pressing step of putting an optical element resin and the base material substrate between optical element lower and upper metal molds formed to correspond to the hole, to mold at least the optical element section; and

a resin curing step of curing the resin using heat or light.

12. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the hole forming step, a light shielding film is patterned and formed by aligning the light shielding film with a position of the hole, and the hole is formed using etching processing, using the light shielding film as a mask.

13. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the pressing step, at least the optical element section is molded while the base material substrate is raised and supported above the lower metal mold.

14. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the pressing step, a space between the lower metal mold and the upper metal mold is controlled to set a thickness of the optical element and a thickness of a flange section in the periphery of the optical element.

15. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the resin curing step, the lower metal mold and the upper metal mold are transparent molds, and light is emitted from at least either of an upper surface or a lower surface of the transparent molds to cure the resin.

16. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the resin curing step, the base material substrate is a glass substrate, and light is emitted from an end surface side of the glass substrate to cure the resin.

17. A method for manufacturing a wafer-shaped optical apparatus according to claim 11, wherein in the resin curing step, while the lower metal mold and the upper metal mold are rotated, light is emitted to cure the resin.