MOUNTING STRUCTURE
First Claim
1. A mounting structure comprising:
- an optoelectronic interconnection module mounted on a mounting board and comprising a flexible optoelectronic interconnection board, electrical interconnection lines formed on a main surface of the flexible optoelectronic interconnection board, optical interconnection lines formed on the flexible optoelectronic interconnection board, an optical semiconductor device mounted on the main surface of the flexible optoelectronic interconnection board and optically coupled with the optical interconnection lines, and first electrical connection terminals that are formed on the main surface of the flexible optoelectronic interconnection board to electrically connect the electrical interconnection lines to an exterior;
the optoelectronic interconnection module comprising a circuit area that includes a region on which the optical semiconductor device is mounted and a region in which the first electrical connection terminals are formed, and an interconnection area that includes a region which is an area other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed;
the first electrical connection terminals being formed on the interconnection area side rather than the optical semiconductor device;
a mounting board comprising electrical interconnection lines and electrical connection terminals that electrically connect the electrical interconnection lines to the exterior on a main surface, the optoelectronic interconnection module being mounted thereon with the main surface of the flexible optoelectronic interconnection board set to face the main surface thereof; and
a conductive connection member provided between the first electrical connection terminals of the optoelectronic interconnection module and the electrical connection terminals of the mounting board to electrically connect, adhere and fix the respective electrical connection terminals.
1 Assignment
0 Petitions
Accused Products
Abstract
A mounting structure includes an optoelectronic interconnection module that includes electrical interconnection lines, optical interconnection lines, optical semiconductor device and electrical connection terminals, a mounting board that includes electrical interconnection lines and electrical connection terminals on a main surface and on which the optoelectronic interconnection module is mounted, and a connection member that electrically connects, adheres and fixes the electrical connection terminals and the electrical connection terminals. The optoelectronic interconnection module comprises a circuit area on which the optical semiconductor device is mounted and electrical connection terminals are formed and an interconnection area that is formed in a region other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed, and the electrical connection terminals are formed on the interconnection area side rather than the optical semiconductor device.
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Citations
19 Claims
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1. A mounting structure comprising:
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an optoelectronic interconnection module mounted on a mounting board and comprising a flexible optoelectronic interconnection board, electrical interconnection lines formed on a main surface of the flexible optoelectronic interconnection board, optical interconnection lines formed on the flexible optoelectronic interconnection board, an optical semiconductor device mounted on the main surface of the flexible optoelectronic interconnection board and optically coupled with the optical interconnection lines, and first electrical connection terminals that are formed on the main surface of the flexible optoelectronic interconnection board to electrically connect the electrical interconnection lines to an exterior;
the optoelectronic interconnection module comprising a circuit area that includes a region on which the optical semiconductor device is mounted and a region in which the first electrical connection terminals are formed, and an interconnection area that includes a region which is an area other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed;
the first electrical connection terminals being formed on the interconnection area side rather than the optical semiconductor device;a mounting board comprising electrical interconnection lines and electrical connection terminals that electrically connect the electrical interconnection lines to the exterior on a main surface, the optoelectronic interconnection module being mounted thereon with the main surface of the flexible optoelectronic interconnection board set to face the main surface thereof; and a conductive connection member provided between the first electrical connection terminals of the optoelectronic interconnection module and the electrical connection terminals of the mounting board to electrically connect, adhere and fix the respective electrical connection terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A mounting structure comprising:
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an optoelectronic interconnection module mounted on a mounting board and comprising a flexible optoelectronic interconnection board, electrical interconnection lines formed on a main surface of the flexible optoelectronic interconnection board, optical interconnection lines formed on the flexible optoelectronic interconnection board, an optical semiconductor device mounted on the main surface of the flexible optoelectronic interconnection board and optically coupled with the optical interconnection lines, a driver IC that is mounted on the main surface of the flexible optoelectronic interconnection board and drives the optical semiconductor device, and first electrical connection terminals that are formed on the main surface of the flexible optoelectronic interconnection board to electrically connect the electrical interconnection lines to an exterior;
the optoelectronic interconnection module comprising a circuit area that includes a region on which the optical semiconductor device and driver IC are mounted and a region in which the first electrical connection terminals are formed, and an interconnection area that comprises a region which is an area other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed;
the first electrical connection terminals being formed on the interconnection area side rather than the optical semiconductor device and driver IC;a mounting board comprising electrical interconnection lines and electrical connection terminals that electrically connect the electrical interconnection lines to the exterior on a main surface, the optoelectronic interconnection module being mounted thereon with the main surface of the flexible optoelectronic interconnection board set to face the main surface thereof; and a conductive connection member provided between the first electrical connection terminals of the optoelectronic interconnection module and the electrical connection terminals of the mounting board to electrically connect, adhere and fix the respective electrical connection terminals. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification