FLUID DISTRIBUTION MANIFOLD INCLUDING BONDED PLATES

• US 20110097487A1
• Filed: 10/27/2009
• Published: 04/28/2011
• Est. Priority Date: 10/27/2009
• Status: Abandoned Application

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Kerr, Roger S., Levy, David H.
• Application Number:
  US12/606,212
• Publication Number:
  US 20110097487A1
• Time in Patent Office: Days
• US Class Current: 427/248.1
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: Y10T 137/8593 Systems
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A fluid distribution manifold includes a first plate and a second plate. At least a portion of at least the first plate and the second plate define a relief pattern. A metal bonding agent is disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern.

Claims

1. A fluid distribution manifold comprising:

a first plate;

a second plate, at least a portion of at least the first plate and the second plate defining a relief pattern; and

a metal bonding agent disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern.

2. The manifold of claim 1, wherein the second plate includes a relief portion disposed opposite the relief portion of the first plate.

3. The manifold of claim 1, wherein the second plate includes a relief portion disposed offset from the relief portion of the first plate.

4. The manifold of claim 1, wherein the flow directing pattern defined by the relief pattern that remains free of the metal bonding agent.

5. The manifold of claim 1, the first plate including an output face, the output face including a finish that is polished prior to being bonded to the second plate.

6. A method of assembling a fluid distribution head comprising:

providing a first plate;

providing a second plate, at least a portion of at least the first plate and the second plate defining a relief pattern;

providing a metal bonding agent disposed between the first plate and the second plate; and

forming a fluid flow directing pattern defined by the relief pattern by bonding the first plate and the second plate together using the metal bonding agent.

7. The method of claim 6, wherein in providing a metal bonding agent disposed between the first plate and the second plate comprises:

providing a layer of metal bonding agent on one of the first plate and the second plate;

applying a mask over the layer of metal bonding agent; and

etching the layer of metal bonding agent and either the first plate or the second plate using the same mask.

8. The method of claim 7, wherein etching the layer of metal bonding agent and either the first plate or the second plate using the same mask includes etching the layer of metal bonding agent and either the first plate or the second plate in the same process step.

9. The method of claim 7, wherein etching the layer of metal bonding agent and either the first plate or the second plate using the same mask includes etching the layer of metal bonding agent and either the first plate or the second plate in separate process steps.

10. A method of depositing a thin film material on a substrate comprising:

providing a substrate;

providing a fluid distribution manifold including;

a first plate;

a second plate, at least a portion of at least the first plate and the second plate defining a relief pattern; and

a metal bonding agent disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern; and

causing a gaseous material to flow from the fluid distribution manifold toward the substrate after causing the gaseous material to flow through the fluid flow directing pattern defined by the relief pattern.