FLUID DISTRIBUTION MANIFOLD INCLUDING NON-PARALLEL NON-PERPENDICULAR SLOTS

• US 20110097493A1
• Filed: 10/27/2009
• Published: 04/28/2011
• Est. Priority Date: 10/27/2009
• Status: Abandoned Application

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Kerr, Roger S., Levy, David H.
• Application Number:
  US12/606,223
• Publication Number:
  US 20110097493A1
• Time in Patent Office: Days
• US Class Current: 427/255.5
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C23C 16/45578 Elongated nozzles, tubes with holes
• CPC Class Codes: C23C 16/45587 Mechanical means for changing the gas flow

Abstract

A fluid conveyance device for thin film material deposition includes a substrate transport mechanism that causes a substrate to travels in a direction. A fluid distribution manifold includes an output face. The output face includes a plurality of elongated slots. At least one of the elongated slots includes a portion that is non-perpendicular and non-parallel relative to the direction of substrate travel.

Claims

1. A fluid conveyance device for thin film material deposition comprising:

a substrate transport mechanism that causes a substrate to travels in a direction; and

a fluid distribution manifold including an output face, the output face including a plurality of elongated slots, at least one of the elongated slots including a portion that is non-perpendicular and non-parallel relative to the direction of substrate travel.

2. The device of claim 1, wherein the at least one elongated slot that includes the non-perpendicular, non-parallel portion includes a radius of curvature.

3. The device of claim 2, wherein the radius of curvature is less than 10 meters.

4. The device of claim 1, wherein the at least one elongated slot that includes the non-perpendicular, non-parallel portion includes multiple directional changes of the path.

5. The device of claim 1, wherein the non-perpendicular, non-parallel portion includes a maximum angle relative to the direction of substrate travel of greater than or equal to 35 degrees.

6. A method of depositing a thin film material on a substrate comprising:

providing a substrate;

providing a fluid conveyance device including;

a substrate transport mechanism that causes a substrate to travels in a direction; and

a fluid distribution manifold including an output face, the output face including a plurality of elongated slots, at least one of the elongated slots including a portion that is non-perpendicular and non-parallel relative to the direction of substrate travel; and

causing a gaseous material to flow from the plurality of elongated slots of the output face of the fluid distribution manifold toward the substrate.

7. A fluid conveyance device for thin film material deposition comprising:

a substrate transport mechanism that causes a substrate to travels in a direction; and

a fluid distribution manifold including an output face, the output face including a plurality of elongated slots, at least one of the elongated slots including an overall shape that is not completely perpendicular or completely parallel relative to the direction of substrate travel.