METHOD AND APPARATUS FOR INTEGRATED-CIRCUIT BATTERY DEVICES
First Claim
1. An integrated-circuit package comprising:
- a substrate in the integrated-circuit package;
an integrated-circuit chip in the integrated-circuit package;
a plurality of electrical conductors electrically connected to the integrated-circuit chip and having electrical terminals on an external surface of the integrated-circuit package;
a thin-film battery provided on the substrate, wherein the thin-film battery includes a first electrode that is connected to an electrical terminal on an external surface of the integrated-circuit package but that is not electrically connected to the integrated-circuit chip in the integrated-circuit package and a second electrode that is electrically connected to an electrical terminal on an external surface of the integrated-circuit package; and
an encapsulant that covers the integrated-circuit chip and the thin-film battery.
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Accused Products
Abstract
A combined battery and device apparatus and associated method. This apparatus includes a first conductive layer, a battery comprising a cathode layer; an anode layer, and an electrolyte layer located between and electrically isolating the anode layer from the cathode layer, wherein the anode or the cathode or both include an intercalation material, the battery disposed such that either the cathode layer or the anode layer is in electrical contact with the first conductive layer, and an electrical circuit adjacent face-to-face to and electrically connected to the battery. Some embodiments further include a photovoltaic cell and/or thin-film capacitor. In some embodiments, the substrate includes a polymer having a melting point substantially below 700 degrees centigrade. In some embodiments, the substrate includes a glass. For example, some embodiments include a battery deposited directly on the back of a liquid-crystal display (LCD) device.
79 Citations
20 Claims
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1. An integrated-circuit package comprising:
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a substrate in the integrated-circuit package; an integrated-circuit chip in the integrated-circuit package; a plurality of electrical conductors electrically connected to the integrated-circuit chip and having electrical terminals on an external surface of the integrated-circuit package; a thin-film battery provided on the substrate, wherein the thin-film battery includes a first electrode that is connected to an electrical terminal on an external surface of the integrated-circuit package but that is not electrically connected to the integrated-circuit chip in the integrated-circuit package and a second electrode that is electrically connected to an electrical terminal on an external surface of the integrated-circuit package; and an encapsulant that covers the integrated-circuit chip and the thin-film battery. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for fabricating an integrated-circuit package comprising:
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providing a substrate; depositing an integrated-circuit chip in the integrated-circuit package; electrically connecting a plurality of electrical terminals on an external surface of the integrated-circuit package to the integrated-circuit chip; depositing a thin-film battery on the substrate, wherein the thin-film battery includes a first electrode that is not electrically connected to the integrated-circuit chip in the integrated-circuit package and a second electrode; electrically connecting the first electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package; electrically connecting the second electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package; and encapsulating the integrated-circuit chip and the thin-film battery to form the integrated-circuit package. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. An apparatus for making an integrated-circuit package having a substrate, the apparatus comprising:
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means for depositing an integrated-circuit chip in the integrated-circuit package; means for electrically connecting a plurality of electrical terminals on an external surface of the integrated-circuit package to the integrated-circuit chip; means for depositing a thin-film battery on the substrate, wherein the thin-film battery includes a first electrode that is not electrically connected to the integrated-circuit chip in the integrated-circuit package and a second electrode; means for electrically connecting the first electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package; means for electrically connecting the second electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package; and means for encapsulating the integrated-circuit chip and the thin-film battery to form the integrated-circuit package. - View Dependent Claims (17, 18, 19, 20)
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Specification