DUAL MODE INDUCTIVELY COUPLED PLASMA REACTOR WITH ADJUSTABLE PHASE COIL ASSEMBLY
First Claim
1. A dual mode inductively coupled plasma processing system, comprising:
- a process chamber having a dielectric lid; and
a plasma source assembly disposed above the dielectric lid, the plasma source assembly comprising;
a plurality of coils configured to inductively couple RF energy into the process chamber to form and maintain a plasma therein;
a phase controller coupled to the plurality of coils for controlling the relative phase of RF current applied to each coil in the plurality of coils; and
an RF generator coupled to the phase controller.
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Accused Products
Abstract
Embodiments of dual mode inductively coupled plasma reactors and methods of use of same are provided herein. In some embodiments, a dual mode inductively coupled plasma processing system may include a process chamber having a dielectric lid and a plasma source assembly disposed above the dielectric lid. The plasma source assembly includes a plurality of coils configured to inductively couple RF energy into the process chamber to form and maintain a plasma therein, a phase controller for adjusting the relative phase of the RF current applied to each coil in the plurality of coils, and an RF generator coupled to the phase controller and the plurality of coils.
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Citations
20 Claims
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1. A dual mode inductively coupled plasma processing system, comprising:
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a process chamber having a dielectric lid; and a plasma source assembly disposed above the dielectric lid, the plasma source assembly comprising; a plurality of coils configured to inductively couple RF energy into the process chamber to form and maintain a plasma therein; a phase controller coupled to the plurality of coils for controlling the relative phase of RF current applied to each coil in the plurality of coils; and an RF generator coupled to the phase controller. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming and using a plasma, comprising:
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providing a process gas to an inner volume of a process chamber having a dielectric lid and having a plurality of coils disposed above the lid; providing RF power to the plurality of coils from an RF power source; forming a plasma from the process gas using the RF power provided by the RF power source that is inductively to the process gas by the plurality of coils; and adjusting the relative phase of RF current applied to each coil in the plurality of coils. - View Dependent Claims (13, 14, 15)
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16. A dual mode inductively coupled plasma processing system, comprising:
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a process chamber having a dielectric lid; an annular heater positioned proximate the dielectric lid; a plasma source assembly disposed above the dielectric lid, the plasma source assembly comprising; a first coil being would in a first direction and a second coil being would in a second direction, the first and second coils configured to inductively couple RF energy into the process chamber to form and maintain a plasma therein; a phase controller coupled to the first and second coils for controlling the relative phase of RF current applied to each coil; one or more electrodes configured to capacitively couple RF energy into the process chamber to form the plasma therein, wherein the one or more electrodes are electrically coupled to one of the one or more coils; and an RF generator coupled to the phase controller and each of the coils through a central feed. - View Dependent Claims (17, 18, 19, 20)
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Specification