CURABLE POLYSILOXANE COMPOSITION, AND POLYSILOXANE CURED PRODUCT, OPTICAL MEMBER, MEMBER FOR AEROSPACE INDUSTRY, SEMICONDUCTOR LIGHT-EMITTING DEVICE, ILLUMINATING DEVICE AND IMAGE DISPLAY DEVICE USING THE SAME

• US 20110098420A1
• Filed: 03/27/2009
• Published: 04/28/2011
• Est. Priority Date: 03/28/2008
• Status: Active Grant

• Current Assignee: Mitsubishi Chemical Corporation (Mitsubishi Chemical Group Corp.)
• Original Assignee: Mitsubishi Chemical Corporation (Mitsubishi Chemical Group Corp.)
• Inventors: Abe, Mari, Mori, Yutaka, Kobayashi, Hiroshi, Kato, Hanako, Takizawa, Kenichi, Koyashiki, Yoshiaki, Shinbara, Masahito, Yamazaki, Masanori
• Granted Patent: US 8,629,222 B2
• Time in Patent Office: Days
• US Class Current: 525/477
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/18 to alkoxy or aryloxy groups
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: C08L 83/06 containing silicon bound to oxygen-containing groups C08L83/12 takes precedence
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

Claims

1. A curable polysiloxane composition, comprising:

a siloxane compound (A), comprising two or more hydrosilyl groups per molecule and a siloxane compound (B), comprising two or more silanol groups per molecule, or a siloxane compound (C), comprising at least one hydrosilyl group and at least one silanol group per molecule; and

a dehydrogenative condensation reaction catalyst,

wherein the curable polysiloxane composition affords a cured product having an average value in height of 0.12 cm or less in a curing test wherein;

(1) 2 g of the curable polysiloxane composition is allowed to stand in a polytetrafluoroethylene container having a basal plane diameter of 5 cm and a height of 1 cm under air at a temperature of 150°

C. for 6 hours, giving a cured product;

then

(2) after (1), it is confirmed that the composition has no fluidity (is cured) even when it is allowed to stand for 30 minutes in a state wherein the basal plane of the polytetrafluoroethylene container is tilted by 45°

; and

then

(3) an average value in height from an inner bottom of the container to a top surface of the cured product is measured.

6. The curable polysiloxane composition according to claim 1, wherein the dehydrogenative condensation reaction catalyst comprises at least one selected from the group consisting of a metal, a hydroxylamine, and boron.

7. The curable polysiloxane composition according to claim 1, further comprising a polysiloxane compound represented by formula (3):

9. The curable polysiloxane composition according to claim 1, which is cured within 6 hours under air at the temperature of 150°

C.

10. The curable polysiloxane composition according to claim 1, wherein a refractive index of the curable polysiloxane composition at temperature of 20°

C. at 589 nm is 1.42 or less.

11. The curable polysiloxane composition according to claim 1, wherein 95 mol % or more of substituents, excluding hydrogen and hydroxyl groups, among all the substituents bound to the silicon atom of the siloxane compound, are methyl groups.

12. The curable polysiloxane composition according to claim 1, wherein at least one selected from the group consisting of Pt, Pd, Pb, Sn, Zn, Fe, Ti, Zr, and Bi, are comprised as a metal component of the dehydrogenative condensation reaction catalyst.

13. A polysiloxane cured product obtained by curing the curable polysiloxane composition according to claim 1.

14. The polysiloxane cured product according to claim 13, wherein a measurement value of hardness (Shore A) by durometer type A ranges from 5 or larger and 90 or smaller, and a light transmittance over whole wavelengths of 400 nm or more and 800 nm or less at a film thickness of 1 mm is 80% or more.

15. An optical member, comprising the polysiloxane cured product according to claim 13.

16. A member for aerospace industry, comprising the polysiloxane cured product according to claim 13.

17. A semiconductor light-emitting device, comprising the optical member according to claim 15.

18. An illuminating device, comprising the semiconductor light-emitting device according to claim 17.

19. An image display device, comprising the semiconductor light-emitting device according to claim 17.

2. (canceled)

3. A curable polysiloxane composition for a semiconductor light-emitting device, which comprises:

a siloxane compound (A), comprising two or more hydrosilyl groups per molecule and a siloxane compound (B), comprising two or more silanol groups per molecule and, or a siloxane compound (C), comprising at least one hydrosilyl group and at least one silanol group; and

a dehydrogenative condensation reaction catalyst.

20. The curable polysiloxane composition according to claim 3, wherein the dehydrogenative condensation reaction catalyst comprises at least one selected from the group consisting of a metal, a hydroxylamine, and boron.

4. (canceled)

5. A curable polysiloxane composition, comprising:

(A) a polysiloxane compound represented by formula (1)

8. The curable polysiloxane composition according to claim 5, which affords a cured product having an average value in height of 0.12 cm or less in a curing test wherein:

(1) 2 g of the curable polysiloxane composition is allowed to stand in a polytetrafluoroethylene container having a basal plane diameter of 5 cm and a height of 1 cm under air at a temperature of 150°

C. for 6 hours, giving a cured product;

then

(2) after (1), it is confirmed that the composition has no fluidity (is cured) even when it is allowed to stand for 30 minutes in a state wherein the basal plane of the polytetrafluoroethylene container is tilted by 45°

; and

then

(3) an average value in height from an inner bottom of the container to a top surface of the cured product is measured.

21. The curable polysiloxane composition according to claim 5, wherein the dehydrogenative condensation reaction catalyst comprises at least one selected from the group consisting of a metal, a hydroxylamine, and boron.

22. The curable polysiloxane composition according to claim 5, further comprising a polysiloxane compound represented by formula (3):