METHOD OF FORMING A PATTERNED SUBSTRATE

• US 20110100957A1
• Filed: 05/26/2009
• Published: 05/05/2011
• Est. Priority Date: 06/30/2008
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Moran, Cristin E., Stay, Matthew S., Pekurovsky, Mikhail L., Frey, Matthew H.
• Granted Patent: US 8,652,345 B2
• Time in Patent Office: Days
• US Class Current: 216/100
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: C23C 18/1601 Process or apparatus
• CPC Class Codes: C23C 18/1603 coating on selected surface areas
• CPC Class Codes: C23C 18/161 from plating step, e.g. inkjet
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2203/0776 Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/1258 by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• CPC Class Codes: H05K 3/182 characterised by the patterning method

Abstract

A method of forming a petterned substracte is provided. The method includes providing a substrate (300) having a structured surface region comprising one or more recessed features (310). The method includes disposing a first liquid (325) onto at least a portion of the structured surface region. The method includes contacting the first liquid with a second liquid (330). The method includes 300 displacing the first liquid with the second liquid from at least a portion (315) of the structured surface region. The first liquid is selectively located in at least a portion of the one or more recessed features.

Claims

1-46. -46. (canceled)

47. A method of forming a patterned substrate comprising:

providing a substrate having a structured surface region comprising one or more recessed features;

disposing a first liquid onto at least a portion of the structured surface region, wherein the first liquid comprises a metal, a metal precursor, an electroless plating catalyst, an electroless plating catalyst precursor, a mask material, or a combination thereof;

contacting the first liquid with a second liquid; and

displacing the first liquid with the second liquid from at least a portion of the structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features.

48. The method of claim 47, wherein the first liquid comprises a metal, or a metal precursor.

49. The method of claim 48, wherein the first liquid comprises a conductive ink.

50. The method of claim 48, wherein the conductive ink comprises a polymeric material.

51. The method of claim 50, further comprising curing the polymeric material after selectively placing the first liquid in at least a portion of the one or more recessed features.

52. The method of claim 47, wherein the first liquid comprises an electroless plating catalyst.

53. The method of claim 47, wherein the first liquid comprises an electroless plating catalyst precursor. ises palladium acetate.

54. The method of claim 53, further comprising heating the electroless plating catalyst precursor after selectively placing the first liquid in at least a portion of the one or more recessed features to form an electroless plating catalyst.

55. The method of claim 47, wherein the first liquid comprises a mask material.

56. The method of claim 55, further comprising curing the mask material after selectively placing the first liquid in at least a portion of the one or more recessed features.

57. The method of claim 55, further comprising depositing a metal layer on the mask material and the structured surface region.

58. The method of claim 57, further comprising removing i) the metal layer deposited on the mask material, and ii) the mask material selectively located in at least a portion of the one or more recessed features.

59. The method of claim 47, further comprising backfilling the recessed features with an adhesive or a refractive index matching material.

60. A method of forming a patterned substrate comprising:

providing a substrate having a metallized structured surface region comprising a metal layer disposed on the substrate, the metallized structured surface region comprising one or more recessed features and a surface region complementary to the one or more recessed features;

disposing a first liquid onto at least a portion of the metallized structured surface region;

contacting the first liquid with a second liquid;

displacing the first liquid with the second liquid from at least a portion of the metallized structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features; and

dissolving at least a portion of the metal layer into the second liquid selectively from the surface region complementary to the one or more recessed features.

61. The method of claim 60, wherein the second liquid comprises water and an etchant.

62. The method of claim 60, wherein the first liquid converts to a solid after the first liquid is selectively located in at least a portion of the one or more recessed features.

63. The method of claim 60, further comprising removing the first liquid from at least a portion of the one or more recessed features after dissolving at least a portion of the metal layer into the second liquid selectively from the surface region complementary to the one or more recessed features.

64. The method of claim 60, further comprising backfilling the recessed features with an adhesive or a refractive index matching material.

65. The method of claim 64, wherein the substrate comprises a microreplicated substrate.

66. A method of forming a patterned substrate comprising:

providing a substrate having a structured surface region comprising one or more recessed features;

disposing a first liquid onto at least a portion of the structured surface region;

contacting the first liquid with a second liquid; and

displacing the first liquid with the second liquid from at least a portion of the structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features, wherein the first liquid converts to a solid after the first liquid is selectively located in at least a portion of the one or more recessed features.