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PAPER INCLUDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

  • US 20110101366A1
  • Filed: 01/06/2011
  • Published: 05/05/2011
  • Est. Priority Date: 06/26/2006
  • Status: Active Grant
First Claim
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1. A paper including a semiconductor device, the semiconductor device comprising:

  • a flexible base; and

    a stacked-layer body over the flexible base, the stacked-layer body comprising an element layer having a circuit including a transistor, and a sealing layer for sealing a top surface of the element layer,wherein a thickness of the semiconductor device is less than or equal to 30 μ

    m.

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