SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate;
a gate insulating film over the semiconductor substrate;
a gate electrode formed over the gate insulating film;
an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing an impurity;
an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance; and
a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity.
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Accused Products
Abstract
According to an aspect of an embodiment, a semiconductor device has a semiconductor substrate, a gate insulating film on the semiconductor substrate, a gate electrode formed on the gate insulating film, an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing impurity, an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance, and a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity.
13 Citations
5 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate; a gate insulating film over the semiconductor substrate; a gate electrode formed over the gate insulating film; an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing an impurity; an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance; and a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity. - View Dependent Claims (2, 3, 4, 5)
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Specification