POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE
First Claim
1. A device comprising:
- a first conductive substrate;
a second conductive substrate;
a first power semiconductor component that has a first thickness and is electrically coupled to said first conductive substrate;
a second power semiconductor component that has a second thickness and is electrically coupled to said second conductive substrate;
a positive terminal electrically coupled to said first conductive substrate;
a negative terminal electrically coupled to said second power semiconductor component; and
an output terminal electrically coupled to said first power semiconductor component and said second conductive substrate,wherein said positive and negative terminals, said first and second power semiconductor components, and said first and second conductive substrates are incorporated into a common circuit loop and are configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
1 Assignment
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Accused Products
Abstract
A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
32 Citations
19 Claims
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1. A device comprising:
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a first conductive substrate; a second conductive substrate; a first power semiconductor component that has a first thickness and is electrically coupled to said first conductive substrate; a second power semiconductor component that has a second thickness and is electrically coupled to said second conductive substrate; a positive terminal electrically coupled to said first conductive substrate; a negative terminal electrically coupled to said second power semiconductor component; and an output terminal electrically coupled to said first power semiconductor component and said second conductive substrate, wherein said positive and negative terminals, said first and second power semiconductor components, and said first and second conductive substrates are incorporated into a common circuit loop and are configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification