SEALED PIXEL ASSEMBLIES, KITS AND METHODS

• US 20110102307A1
• Filed: 01/10/2011
• Published: 05/05/2011
• Est. Priority Date: 10/14/2004
• Status: Active Grant

• Current Assignee: Daktronics Incorporated
• Original Assignee: Daktronics Incorporated
• Inventors: Grebel, Erich J., Bravek, Eric S., Wendler, Brett D.
• Granted Patent: US 8,552,928 B2
• Time in Patent Office: Days
• US Class Current: 345/83
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: G09F 9/301 flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: G09G 2300/04 Structural and physical details of display devices
• CPC Class Codes: G09G 2300/0426 Layout of electrodes and connections
• CPC Class Codes: G09G 2310/0221 with use of split matrices G09G3/3644 and G09G3/3666 take precedence
• CPC Class Codes: G09G 3/06 using controlled light sources
• CPC Class Codes: G09G 3/12 using electroluminescent elements
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

Discrete flexible pixel assemblies can be hermetically sealed from the environment and can comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel assemblies can include encapsulation means, exterior encasement means, and cable connector means.

Claims

1. A sealed pixel assembly comprising:

a circuit board assembly;

one or more light emitting elements coupled with the circuit board assembly;

an encapsulation material covering at least a portion of the circuit board assembly; and

one or more cables extending from the circuit board assembly, the one or more cables configured for coupling with at least one other sealed pixel assembly to form an electronic display.

2. The sealed pixel assembly of claim 1, wherein the encapsulation material covers a base end of each of the one or more light emitting elements.

3. The sealed pixel assembly of claim 1, wherein a top end of each of the one or more light emitting elements extends out of the encapsulation material.

4. The sealed pixel assembly of claim 1, further comprising an encasement cover having an internal cavity configured to receive at least a portion of the circuit board assembly, the one or more light emitting elements, and the encapsulation material.

5. The sealed pixel assembly of claim 4, wherein the encapsulation material is positioned in the encasement cover after the encasement cover receives at least a portion the circuit board assembly and the one or more light emitting elements.

6. The sealed pixel assembly of claim 5, wherein the encasement cover includes one or more light emitting orifices, each light emitting orifice configured to receive a top end of a light emitting element.

7. The sealed pixel assembly of claim 4, wherein the encasement cover is transparent.

8. The sealed pixel assembly of claim 4, wherein the encasement cover is optically opaque.

9. The sealed pixel assembly of claim 4, wherein the encasement cover is configured to receive and engage a barrier seal to establish a sealed barrier between the internal cavity and an exterior environment.

10. The sealed pixel assembly of claim 1, further comprising an input connector and an output connector, the input and output connectors coupled to the circuit board assembly by the one or more cables.

11. The sealed pixel assembly of claim 1, wherein the circuit board assembly includes one or more circuit boards, and wherein a portion of the one or more cables are covered with the encapsulation material at the point of coupling to at least one of the one or more circuit boards.

12. The sealed pixel assembly of claim 1, wherein the one or more light emitting elements include a plurality of red, green or blue LEDs.

13. The sealed pixel assembly of claim 1, wherein the encapsulation material includes resin or gel that is configured to harden on exposure to the atmosphere, heat, or a reactive agent.

14. The sealed pixel assembly of claim 1, wherein the encapsulation material includes ductile foam.

15. The sealed pixel assembly of claim 1, further comprising one or more mechanical fasteners configured to couple the circuit board assembly to a non-planar mounting surface.

16. A kit comprising:

a plurality of sealed pixel assemblies as recited in claim 1,

wherein the plurality of sealed pixel assemblies are configured to conform to a non-planar surface and provide an electronic display.

17. A method comprising:

providing or obtaining a plurality of sealed pixel assemblies, wherein each sealed pixel assembly includes a circuit board assembly, one or more light emitting elements coupled with the circuit board assembly, an encapsulation material covering at least a portion of the circuit board assembly, and one or more cables extending from the circuit board assembly; and

connecting the plurality of sealed pixel assemblies to form a flexible pixel string, including coupling an output connector of a first sealed pixel assembly and an input connector of a second sealed pixel assembly.

18. The method of claim 17, further comprising combining at least a first flexible pixel string and a second flexible pixel string to form an electronic display.

19. The method of claim 17, further comprising coupling the plurality of sealed pixel assemblies to a non-planar mounting surface using one or more mechanical fasteners.

20. The method of claim 17, wherein connecting the plurality of sealed pixel assemblies includes serially coupling cables of adjacent sealed pixel assemblies, wherein each cable extends from at least one of one or more circuit boards of a respective circuit board assembly.