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HIGH SPEED DISTRIBUTED OPTICAL SENSOR INSPECTION SYSTEM

  • US 20110102575A1
  • Filed: 11/05/2010
  • Published: 05/05/2011
  • Est. Priority Date: 09/22/2009
  • Status: Active Grant
First Claim
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1. An electronics assembly line comprising:

  • a first electronics assembly machine, having a first electronics assembly machine outlet;

    a second electronics assembly machine, having a second electronics assembly machine inlet and outlet, the inlet of the second electronics assembly machine being coupled to the outlet of the first electronics assembly machine by a conveyor;

    a first optical inspection sensor disposed over the conveyor before the inlet of the second electronics assembly and configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion;

    a second optical inspection sensor disposed over a conveyor after the outlet of the second electronics assembly machine and configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion; and

    a computer operably coupled to the first and second optical inspection sensors, the computer being configured to provide an inspection result based upon at least one of the first and second inspection image data.

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