APPARATUS FOR AND METHOD OF COOLING ELECTRONIC CIRCUITS
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Accused Products
Abstract
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.
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Citations
65 Claims
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1-29. -29. (canceled)
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30. A compact power conversion device comprising:
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a) AC power supply leads comprising a prong end configured to plug into an AC wall socket coupled to an AC power supply network and a thermally conductive end; b) an AC to DC (AC/DC) power conversion circuit configured to receive electric power from the AC power supply network via the AC power supply leads; c) a heat conductive body thermally coupled with the AC/DC power conversion circuit and thermally coupled to the thermally conductive end of the AC power supply leads, wherein the thermally conductive end is configured to conduct heat generated by the AC/DC power conversion circuit to the AC power supply leads, into the AC wall socket, and into the AC power supply network, and further wherein the heat conductive body is molded around at least a portion of the AC/DC power conversion circuit and is molded around at least a portion of the thermally conductive end forming a contact area wherein the contact area is configured for the heat to flow through the AC power supply leads, into the AC wall socket and into the AC power supply network, and wherein the heat conductive body comprises a material providing at least the minimum required electrical insulation between the AC power supply leads to prevent electrical shorting of the AC power supply leads; and d) a substantially rigid body encasing the heat conductive body and the AC/DC power conversion circuit wherein the prong end of the AC power supply leads protrude from the rigid body and wherein a thermal conductivity of the rigid body is configured such that the heat conductive body substantially efficiently transfers heat from AC/DC the power conversion circuit to the AC power supply leads, wherein the substantially rigid body limits thermal conductivity such that the rigid body external surface does not exceed 70°
C. in temperature. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A method of cooling an AC/DC electronic device supplied by an external power source, the method comprising:
a) thermally coupling for substantially efficient heat transfer at least a portion of the AC/DC electronic device to a thermally conductive body; b) thermally coupling at least a portion of each of a plurality of AC power supply leads and AC/DC electronic device to the thermally conductive body by molding the thermally conductive body around the at least a portion of the of each of a plurality of AC power supply leads and AC/DC electronic device with a material providing at least the minimum required electrical insulation between the AC power supply leads to prevent electrical shorting of the AC power supply leads; and c) encasing the thermally conductive body and the AC/DC electronic device in a substantially rigid body wherein the AC power supply leads protrude from the body and wherein a thermal conductivity of the rigid body is configured so that there is a substantially efficient heat transfer through thermally conductive body to the AC power supply leads, wherein the substantially rigid body limits heat dissipation such that the surface temperature of the substantially rigid body does not exceed 70°
C. in temperature.- View Dependent Claims (44, 45, 46, 47)
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48. An AC/DC converter assembly comprising:
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a) an AC/DC converter circuit having a primary portion and a secondary portion, the primary portion and the secondary portion having a space between them with a thickness; b) a plurality of AC plugs electrically coupled with the AC/DC converter circuit, wherein the AC plugs are configured to plug into an AC wall socket coupled to an AC power supply network; c) a housing comprising a thermally conductive and electrically resistive body molded around the primary portion of the AC/DC converter circuit and also around each of the plurality of AC plugs so that the thermally conductive and electrically resistive body is thermally coupled with the AC plugs and the AC/DC converter circuit, wherein the thermally conductive and electrically resistive body comprises a material providing at least the minimum required electrical insulation between the AC plugs to prevent electrical shorting of the AC plugs; and d) a substantially rigid body encasing the housing and the AC/DC converter circuit wherein the AC plugs protrude from the substantially rigid body and wherein a thermal conductivity of the substantially rigid body is configured to substantially efficiently conduct heat transfer from the AC/DC converter circuit through the housing to the AC plugs and on to the AC wall socket and to the AC power supply network, wherein the substantially rigid body limits heat dissipation such that the surface temperature of the substantially rigid body does not exceed 70°
C. in temperature. - View Dependent Claims (49, 50, 51, 52, 53, 54)
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55. A method of manufacturing a power adaptor, comprising the steps:
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a) providing an AC/DC power conversion circuit, including a plurality of AC power supply leads configured to plug into an AC wall socket, power conversion components, and power output leads; b) molding a heat conductive material around the power conversion components to form an AC plug structure and integrated strain relief structure thermally connected to one or more of the plurality of AC power supply leads and the AC/DC power conversion circuit, wherein molding a heat conductive material around the power conversion components comprises molding a material around the power conversion components that provides at least the minimum required electrical insulation between the AC power supply leads to prevent electrical shorting of the AC power supply leads; and c) encasing the heat conductive material and the power conversion components with a housing wherein the AC power supply leads protrude from the housing and wherein a thermal conductivity of the housing is configured such that is a substantially efficient heat transfer of the heat generated by the power conversion components through the heat conductive material to the AC power supply leads and into the AC wall socket, of sufficient thermal conductivity to not exceed 70°
C. - View Dependent Claims (56, 57, 58)
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- 59. A device for cooling one or more AC/DC electronic circuits supplied by an external AC power source via a plurality of AC power supply leads configured to plug into an AC wall socket, the AC/DC circuits comprising a plurality of circuit elements, the elements further comprising heat producing elements, the device comprising a thermally conductive mass thermally coupled with at least the heat producing elements of the AC/DC circuits and with the AC power supply leads, wherein a substantial portion of heat produced by the heat producing elements is conducted to the AC power supply leads, and wherein the thermally conductive mass comprises a material providing at least the minimum required electrical insulation between the AC power supply leads to prevent electrical shorting of the AC power supply leads.
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62. A system for cooling an AC/DC electronic device, the AC/DC device comprising heat generating elements and supplied by an external AC power source, the system comprising:
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a) means for conductively capturing heat produced by the heat generating elements of the AC/DC device; b) means for conducting the heat captured from the heat generating elements of the AC/DC device into the external AC power source, and c) means for limiting the heat conduction from the heat generating elements, wherein the means for limiting the heat conduction dissipates heat such that a surface temperature of the means for limiting the heat conduction does not exceed 70°
C. in temperature. - View Dependent Claims (63, 64, 65)
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Specification