SUBSTRATE LASER OXIDE REMOVAL PROCESS FOLLOWED BY ELECTRO OR IMMERSION PLATING

• US 20110104396A1
• Filed: 11/05/2010
• Published: 05/05/2011
• Est. Priority Date: 11/05/2009
• Status: Active Grant

• Current Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Original Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Inventors: Von Gutfeld, Robert J., West, Alan C.
• Granted Patent: US 8,985,050 B2
• Time in Patent Office: Days
• US Class Current: 427/554
• CPC Class Codes: B05C 1/06 by rubbing contact, e.g. by brushes, by pads brushes in general A46B
• CPC Class Codes: B05D 3/06 by exposure to radiation B05D3/02 takes precedence ; plasma treatment B05D3/141
• CPC Class Codes: C25D 17/00 Constructional parts, or assemblies thereof, of cells for electrolytic coating
• CPC Class Codes: C25D 5/34 Pretreatment of metallic surfaces to be electroplated
• CPC Class Codes: C25D 5/36 of iron or steel
• CPC Class Codes: C25D 5/38 of refractory metals or nickel
• CPC Class Codes: C25D 5/44 Aluminium

Abstract

Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.

Claims

1. A method of ablating the surface of a substrate comprising:

(a) providing a dry substrate and an electrolyte;

(b) ablating the surface of the dry substrate to at least partially remove a native oxide layer thereon; and

(c) immersing the ablated dry substrate in the electrolyte, wherein the dry substrate is ablated prior to being introduced into the electrolyte.

2. The method of claim 1, further comprising:

(d) plating the substrate obtained in (c) with a metal.

3. The method of claim 2, wherein the substrate is plated in the electrolyte.

4. The method of claim 1, wherein the dry substrate comprises a substrate selected from aluminum, titanium, tungsten, tantalum, molybdenum, and stainless steel.

5. The method of claim 1, wherein the electrolyte comprises an electrolyte obtained from a source selected from a silver solution, a gold solution, a copper solution, a nickel solution.

6. The method of claim 1, wherein the time between ablating the surface of the dry substrate in (b) and immersing the ablated dry substrate in (c) is less than one second.

7. The method of claim 6, wherein the time between ablating the surface of the dry substrate in (b) and immersing the ablated dry substrate in (c) is less than 100 milliseconds (ms).

8. The method of claim 1, wherein the surface of the dry substrate is ablated with a laser having a frequency in the ultraviolet (UV) to infrared (IR) spectral range.

9. A system for use in the ablation of the surface of a substrate using an electrolyte source, comprising:

(a) a laser to provide a laser beam;

(b) a substrate; and

(d) a conveyor to direct the substrate towards the electrolyte source;

wherein the laser and substrate are configured such that the laser beam contacts the substrate in a dry form prior to being introduced to the electrolyte source.

10. The system of claim 9, wherein the electrolyte source comprises a container of the electrolyte.

11. The system of claim 10, wherein the container of the electrolyte includes an electrolyte air interface, and the distance between where the laser beam strikes the substrate and the electrolyte air interface is from about 5 mm to about 15 mm.

12. The system of claim 9, wherein the electrolyte source comprises a wetting pad.

13. The system of claim 12, wherein the container of the electrolyte includes an electrolyte air interface, and the distance between where the laser beam strikes the substrate and the wetting pad is from about 5 mm to about 15 mm

14. A method of ablating the surface of a substrate comprising:

(a) providing a dry substrate and an electrolyte;

(b) depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns;

(c) ablating the surface of the substrate with the electrolyte applied thereon.

15. The method of claim 14, wherein the electrolyte is deposited on the substrate with a wetting pad.

16. The method of claim 15, wherein the wetting pad comprises a sponge.

17. The method of claim 14, wherein the wetting pad deposits the electrolyte on the substrate at a thickness of from about 200 nm to about 600 nm.

18. The method of claim 14, further comprising:

(d) introducing the substrate to a second electrolyte after the surface of the substrate is ablated.

19. The method of claim 18, wherein the second electrolyte is obtained from a source selected from a container of electrolyte solution and a wetting pad.

20. A system for use in the ablation of the surface of a substrate comprising:

(a) a laser to provide a laser beam;

(b) a substrate;

(c) a wetting pad that includes an electrolyte; and

(d) a support block configured to direct the substrate towards the wetting pad;

wherein the laser and substrate are configured such that the laser beam contacts the substrate prior to being introduced to the wetting pad.

21. The system of claim 20, wherein the wetting pad is configured to deposit the electrolyte on the substrate at a thickness of from about 200 nm to about 10 microns.