MRI-COMPATIBLE IMPLANTABLE LEAD HAVING A HEAT SPREADER AND METHOD OF USING SAME

• US 20110106231A1
• Filed: 11/05/2009
• Published: 05/05/2011
• Est. Priority Date: 11/05/2009
• Status: Active Grant

• Current Assignee: Pacesetter Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Pacesetter Incorporated (Abbott Laboratories Incorporated)
• Inventors: Lepe, Jose, Min, Xiaoyi, Viohl, Ingmar, Chen, Xiangqun, Doan, Phong D.
• Granted Patent: US 8,554,338 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/36071 Pain

Abstract

An implantable lead is provided that comprises a lead body and a header assembly. The lead body has a distal end and a proximal end. The lead body is configured to be implanted in a patient. The header assembly is provided at the distal end of the lead body and includes an internal chamber and a tissue engaging end. An electrode is provided on the header assembly. The electrode is configured to deliver a stimulating pulse. A resonant inductor is located within the chamber in the header assembly. An electrically floating heat spreader is provided on the header assembly. The heat spreader is located proximate to the resonant inductor and is positioned on the header assembly to cover at least a portion of the resonant inductor. The heat spreader is thermally coupled to the resonant inductor to convey thermal energy away from the header assembly.

Claims

1. An implantable lead, comprising:

a lead body, having a distal end and a proximal end, configured to be implanted in a patient;

a header assembly provided at the distal end of the lead body, the header assembly including an internal chamber and a tissue engaging end;

an electrode provided on the header assembly, the electrode configured to deliver stimulating pulses;

a resonant inductor located within the chamber of the header assembly; and

an electrically floating heat spreader provided on the header assembly, the heat spreader being located proximate to the resonant inductor and positioned on the header assembly to cover at least a portion of the resonant inductor, the heat spreader being thermally coupled to the resonant inductor to convey thermal energy away from the header assembly.

2. The implantable lead of claim 1, wherein the heat spreader includes a sleeve that wraps about a housing wall of the header assembly.

3. The implantable lead of claim 1, wherein the heat spreader extends concentrically about the resonant inductor, the header assembly having a housing wall that separates the heat spreader from the resonant inductor.

4. The implantable lead of claim 1, wherein the resonant inductor includes at least one insulated filar that is helically wound about a housing of the header assembly.

5. The lead of claim 1, wherein the header assembly includes a housing with an opening at the tissue engaging end, and a fixation member provided in the chamber proximate the tissue engaging end, the resonant inductor movably located in the chamber.

6. The lead of claim 1, wherein the electrode is located proximate to the tissue engaging end of the header assembly, while the heat spreader and resonant inductor are located at an intermediate position along the header assembly.

7. The lead of claim 1, wherein the electrode constitutes one of a tip, ring and coil electrode, the resonant inductor being electrically connected to the electrode.

8. The lead of claim 1, wherein the header assembly includes a housing having an outer surface that includes a peripheral recess extending thereabout, the heat spreader being located in the peripheral recess about the exterior perimeter of the housing.

9. The lead of claim 1, wherein the header assembly includes a housing having an outer wall with a central lumen therethrough, the outer wall being positioned between and electrically separating the heat spreader from the resonant inductor.

10. The lead of claim 1, wherein the resonant inductor includes capacitive components and inductive components connected in series and tuned to a resonant frequency of an MR scanner.

11. The lead of claim 1, wherein the heat spreader is ungrounded and electrically isolated from the electrode and resonant inductor.

12. The lead of claim 1, wherein the head assembly is a PEEK lead header.

13. The lead of claim 1, wherein the resonant inductor includes an insulated coil wrapped about a dielectric core, the core having a cavity formed therein and extending along the resonant inductor, the cavity retaining an inner heat spreader.

14. The lead of claim 1, wherein the heat spreader extends along a longitudinal axis of the header assembly, the heat spreader having a plurality of annular grooves wrapping about the longitudinal axis around a perimeter of the heat spreader.

15. The lead of claim 1, wherein the heat spreader extends along a longitudinal axis of the header assembly, the heat spreader having a plurality of longitudinal grooves extending in a direction parallel to the longitudinal axis and spaced apart from one another about a perimeter of the heat spreader.

16. The lead of claim 1, wherein the heat spreader is held in a recess in a housing of the header assembly such that an inner surface of the heat spreader is spaced apart from an outer wall of the housing by an air gap.

17. The lead of claim 1, wherein the header assembly has a housing with a cavity formed therein, the heat spreader being embedded within the cavity in the housing.