IN-SITU OPTICAL CRACK MEASUREMENT USING A DOT PATTERN

• US 20110106459A1
• Filed: 10/29/2009
• Published: 05/05/2011
• Est. Priority Date: 10/29/2009
• Status: Abandoned Application

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Northrop Grumman Corporation
• Inventors: Papazian, John M., Nardiello, Jerrell A., Christ, Robert J. JR., Fridline, Daniel R.
• Application Number:
  US12/608,497
• Publication Number:
  US 20110106459A1
• Time in Patent Office: Days
• US Class Current: 702/42
• CPC Class Codes: G01N 21/892 characterised by the flaw, defect or object feature examined
• CPC Class Codes: G01N 2203/0216 Finite elements
• CPC Class Codes: G01N 2203/0647 Image analysis
• CPC Class Codes: G01N 3/06 Special adaptations of indicating or recording means

Abstract

A method of detecting cracks in an object includes: capturing a first image of a pattern of marks in a region of interest on a surface of the object; constructing a finite element model of the region of interest having nodes corresponding to the marks in the pattern; subjecting the object to a first mechanical load to produce strains in the object; capturing a second image of the pattern; computing strains in the object based on relative changes in locations of the marks in the first and second images; modifying the finite element model to produce a crack versus surface strain map; capturing a third image of the pattern; and comparing the locations of marks in the third image to the crack versus surface strain map to identify a crack in the object. An apparatus that performs the method is also provided.

Claims

1. A method of detecting cracks in an object, the method comprising:

capturing a first image of a pattern of marks in a region of interest on a surface of the object;

constructing a finite element model of the region of interest having nodes corresponding to the marks in the pattern;

subjecting the object to a first mechanical load to produce strains in the object;

capturing a second image of the pattern;

computing strains in the object based on relative changes in locations of the marks in the first and second images;

modifying the finite element model to produce a crack versus surface strain map;

capturing a third image of the pattern; and

comparing the locations of marks in the third image to the crack versus surface strain map to identify a crack in the object.

2. The method of claim 1, wherein the step of modifying the finite element model to produce a crack versus surface strain map comprises:

inserting crack information in the finite element model and simulating deformation of the pattern of marks under the first mechanical load.

3. The method of claim 1, wherein the region of interest comprises an area around a feature in the object.

4. The method of claim 3, wherein the feature comprises a hole in the object.

5. The method of claim 1, wherein the marks comprise dots having a diameter of about 0.005 inch and centers spaced at about 0.020 inch.

6. The method of claim 1, wherein the marks are arranged in a two-dimensional array.

7. The method of claim 1, wherein the marks are arranged in a three-dimensional array.

8. The method of claim 1, wherein the step of comparing the locations of marks in the third image to the surface strain map to identify a crack in the object comprises:

locating the centers of the marks in the third image; and

determining the distance between the centers of the marks in the third image and marks in the surface strain map.

9. The method of claim 1, further comprising:

producing an output having information about a crack in the object.

10. An apparatus for detecting cracks in an object, the apparatus comprising:

an image capture device for capturing first, second and third images of a pattern of marks in a region of interest on a surface of the object; and

a processor for implementing a finite element model of the region of interest having nodes corresponding to the marks in the pattern, computing strains in the object based on relative changes in locations of the marks in the first and second images after the object has been subject to a mechanical load, modifying the finite element model to produce a crack versus surface strain map, and comparing the locations of marks in the third image to the crack versus surface strain map to identify a crack in the object.

11. The apparatus of claim 10, wherein the processor inserts crack information in the finite element model and simulates deformation of the pattern of marks under the first mechanical load.

12. The apparatus of claim 10, wherein the region of interest comprises an area around a feature in the object.

13. The apparatus of claim 12, wherein the feature comprises a hole in the object.

14. The apparatus of claim 10, wherein the marks comprise dots having a diameter of about 0.005 inch and centers spaced at about 0.020 inch.

15. The apparatus of claim 10, wherein the marks are arranged in a two-dimensional array.

16. The apparatus of claim 10, wherein the marks are arranged in a three-dimensional array.

17. The apparatus of claim 10, wherein the processor locates the centers of the marks in the third image, and determines the distance between the centers of the marks in the third image and marks in the surface strain map.