METHOD AND APPARATUS ADAPTED TO PREVENT CODE DATA FROM BEING LOST IN SOLDER REFLOW
First Claim
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1. A method of managing program code in a semiconductor device comprising a first non-volatile memory and a second non-volatile memory, the method comprising:
- writing the program code to the first non-volatile memory before a solder reflow process is performed; and
copying the program code from the first non-volatile memory to a second non-volatile memory after the solder reflow process is performed.
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Abstract
A semiconductor device comprises a first non-volatile memory configured to store program code and a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory after a solder reflow process. The processor typically copies the program code from the first non-volatile memory to the second non-volatile memory after the processor is completely booted.
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Citations
20 Claims
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1. A method of managing program code in a semiconductor device comprising a first non-volatile memory and a second non-volatile memory, the method comprising:
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writing the program code to the first non-volatile memory before a solder reflow process is performed; and copying the program code from the first non-volatile memory to a second non-volatile memory after the solder reflow process is performed. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a first non-volatile memory configured to store program code; and a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory after a solder reflow process is performed. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A semiconductor system comprising:
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a semiconductor device; and a central processing unit (CPU) configured to control operation of the semiconductor device, wherein the semiconductor device comprises; a first non-volatile memory configured to store a program code; and a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory after a solder reflow process is performed. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification