SMART CARD MODULE WITH FLIP-CHIP-MOUNTED SEMICONDUCTOR CHIP

• US 20110108629A1
• Filed: 11/05/2010
• Published: 05/12/2011
• Est. Priority Date: 11/06/2009
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: MUELLER-HIPPER, Andreas, PUESCHNER, Frank
• Granted Patent: US 8,448,868 B2
• Time in Patent Office: Days
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.

Claims

1. A smart card module comprising:

a base material with at least one metal layer,

a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; and

an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer.

2. The smart card module of claim 1, wherein the encapsulation layer completely covers the entire base material facing the semiconductor chip.

3. The smart card module of claim 1, wherein the encapsulation layer covers at least a portion of the base material facing the semiconductor chip.

4. The smart card module of claim 1, wherein the smart card module further comprises an antenna coil that is disposed over the at least one metal layer.

5. The smart card module of claim 1, wherein the encapsulation layer comprises a plastic layer and a second metal layer.

6. The smart card module of claim 1, wherein the encapsulation layer is a resin coated copper foil.

7. The smart card module of claim 1, wherein the base material comprises epoxy resin and glass fiber fabric and wherein the at least one metal layer comprises at least one copper layer.

8. The smart card module of claim 1, further comprising an adhesive layer disposed between the contact side of the semiconductor chip and the base material.

9. The smart card module of claim 1, further comprising a second metal layer applied to a non-metallized side of the base material.

10. The smart card module of claim 9, wherein the at least one metal layer is connected to the second metal layer by a plurality of through connections.

11. The smart card module of claim 9, further comprising a third metal layer disposed over the encapsulation layer.

12. A smart card module comprising:

a base material having a first side and a second side;

a first metal layer disposed over the first side of the base material;

a semiconductor chip disposed over the first metal layer, the semiconductor chip having a plurality of contacts electrically connected to the first metal layer; and

an encapsulation layer disposed over the semiconductor chip.

13. The smart card module of claim 12, further comprising:

a second metal layer disposed over the encapsulation layer.

14. The smart card module of claim 12, further comprising:

a third metal layer disposed over the second side of the base material.

15. The smart card module of claim 14, wherein the third metal layer is connected to the first metal layer through a plurality of through connections.

16. A method for producing a smart card module comprising:

providing a base material with at least one metal layer;

disposing a semiconductor chip having a plurality of contacts over the at least one metal layer of the base material; and

encapsulating the semiconductor chip and at least a portion of the at least one metal layer and the base material with an encapsulation layer.

17. The method of claim 16, further comprising:

disposing a second metal layer over the encapsulation layer.

18. The method of claim 16, wherein encapsulating the semiconductor chip and at least a portion of the at least one metal layer and the base material with an encapsulation layer comprises:

encapsulating entirety of the base material and the at least one metal layer with an encapsulation layer.

19. The method of claim 16, wherein disposing a semiconductor chip having a plurality of contacts over the at least one metal layer of the base material comprises:

soldering a plurality of contact bumps between the plurality of contacts and the at least one metal layer, or

disposing an adhesive layer between the at least one metal layer and semiconductor chip.

20. The method of claim 16, further comprising:

disposing a third metal layer over a non-metallic side of the base material; and

connecting the third metal layer with the at least one metal layer through a plurality of through connections.