ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME

• US 20110108811A1
• Filed: 10/27/2010
• Published: 05/12/2011
• Est. Priority Date: 11/06/2009
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: SEO, Jeongdae, Lee, Jeongwon
• Granted Patent: US 8,350,258 B2
• Time in Patent Office: Days
• US Class Current: 257/40
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/873 Encapsulations

Abstract

An organic light emitting diode display and a method of manufacturing the same are disclosed. The organic light emitting diode display includes a first substrate, an organic light emitting diode that is positioned on the first substrate and includes a first electrode, an organic layer having at least a light emitting layer, and a second electrode, an organic buffer layer that is positioned on an entire surface of the organic light emitting diode and has a hydroxy group or an amide group, a sealant positioned on an entire surface of the organic buffer layer, and a second substrate positioned on the sealant.

Claims

1. An organic light emitting diode display comprising:

a first substrate;

an organic light emitting diode positioned on the first substrate, the organic light emitting diode including a first electrode, an organic layer having at least a light emitting layer, and a second electrode;

an organic buffer layer positioned on an entire surface of the organic light emitting diode, the organic buffer layer having a hydroxy group or an amide group;

a sealant positioned on an entire surface of the organic buffer layer; and

a second substrate positioned on the sealant.

2. The organic light emitting diode display of claim 1, wherein the organic buffer layer is formed of a compound represented by the following chemical formula 1:

3. The organic light emitting diode display of claim 2, wherein the compound represented by the chemical formula 1 is one selected from a group consisting of the following compounds.

4. The organic light emitting diode display of claim 3, wherein the compound has a molecular weight of 200 Mw to 5,000 Mw.

5. The organic light emitting diode display of claim 1, wherein the sealant comprises an epoxy-based material.

6. The organic light emitting diode display of claim 1, wherein the organic layer further includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

7. A method of manufacturing an organic light emitting diode display comprising:

forming an organic light emitting diode including a first electrode, an organic layer having at least a light emitting layer, and a second electrode on a first substrate;

forming an organic buffer layer having a hydroxy group or an amide group on an entire surface of the organic light emitting diode;

forming a sealant on an entire surface of the organic buffer layer; and

attaching a second substrate opposite the first substrate to the first substrate.

8. The method of claim 7, wherein the organic buffer layer is formed of a compound represented by the following chemical formula 1:

9. The method of claim 8, wherein the compound represented by the chemical formula 1 is one selected from a group consisting of the following compounds.

10. The method of claim 7, further comprising, after forming the sealant, curing the sealant.