Organic Light Emitting Display Device and Manufacturing Method Thereof

• US 20110108848A1
• Filed: 10/14/2010
• Published: 05/12/2011
• Est. Priority Date: 11/11/2009
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: You, Chun-Gi, Park, Jong-Hyun, Park, Sun, Lee, Yul-Kyu, Kang, Jin-Hee
• Granted Patent: US 8,558,239 B2
• Time in Patent Office: Days
• US Class Current: 257/72
• CPC Class Codes: H10K 59/1213 the pixel elements being TFTs
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements

Abstract

An organic light emitting display having an active layer of a thin film transistor formed on a substrate, a first conductive layer formed at an edge of the active layer, a first insulation layer formed on the substrate and the first conductive layer, a second conductive layer corresponding to a central area of the active layer formed on the first insulation layer, a fanout lower electrode separated a predetermined distance from the second conductive layer, a pixel electrode, a third conductive layer formed on the second conductive layer, a fanout upper electrode formed on the fanout lower electrode, a second insulation layer formed on the third conductive layer, the fanout upper electrode, and the pixel electrode, and source and drain electrodes contacting the pixel electrode and formed on the second insulation layer.

Claims

1. An organic light emitting display device comprising:

an active layer of a thin film transistor formed on a substrate;

a first conductive layer separately formed at opposite edge portions of the active layer;

a first insulation layer formed on the substrate and the first conductive layer;

a second conductive layer formed to correspond to a central area of the active layer with the first insulation layer interposed therebetween;

a fanout lower electrode separated a predetermined distance from the second conductive layer and formed of the same material in the same layer as that of the second conductive layer;

a pixel electrode separated a predetermined distance from the second conductive layer and formed of the same material in the same layer as that of the second conductive layer;

a third conductive layer formed on the second conductive layer;

a fanout upper electrode formed on the fanout lower electrode and formed of the same material in the same layer as that of the third conductive layer;

a second insulation layer formed on the third conductive layer, the fanout upper electrode, and the pixel electrode; and

source and drain electrodes contacting the pixel electrode and formed on the second insulation layer.

2. The organic light emitting display device of claim 1, further comprising:

a first lower electrode of a capacitor separated from a predetermined distance from the active layer and formed of the same material in the same layer as that of the active layer;

a first upper electrode formed on the first lower electrode of the capacitor and formed of the same material in the same layer as that of the first conductive layer;

a second lower electrode formed on the first upper electrode of the capacitor and formed of the same material in the same layer as that of the second conductive layer with the first insulation layer interposed therebetween; and

a second upper electrode formed on the second lower electrode of the capacitor and formed of the same material in the same layer as that of the third conductive layer.

3. The organic light emitting display device of claim 1, the second conductive layer comprising at least one material selected from a group consisting of ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), and In2P3 (indium oxide).

4. The organic light emitting display device of claim 1, the third conductive layer comprising at least one material selected from a group consisting of Ag (silver), Mg (magnesium), Al (aluminum), Pt (platinum), Pd (palladium), Au (gold), Ni (nickel), Nd (neodymium), Ir (iridium), Cr (chromium), Li (lithium), Ca (calcium), Mo (molybdenum), Ti (tin), W (tungsten), MoW (molybdenum-tungsten), and Al/Cu (aluminum/copper).

5. The organic light emitting display device of claim 1, further comprising a pixel define layer formed at an edge of the pixel electrode to have the pixel electrode exposed.

6. The organic light emitting display device of claim 1, the active layer being polycrystal silicon obtained by crystallizing amorphous silicon.

7. The organic light emitting display device of claim 1, the first conductive layer comprising impurity doped silicon.

8. The organic light emitting display device of claim 2, the end portions of the active layer and the first conductive layer being arrayed on the same plane and end portions of the first lower electrode and the first upper electrode of the capacitor being arrayed on the same plane.

9. The organic light emitting display device of claim 2, end portions of the second conductive layer and the third conductive layer being arrayed on the same plane, end portions of the lower electrode and the upper electrode of the fanout being arrayed on the same plane, and end portions of the second lower electrode and the second upper electrode of the capacitor being arrayed on the same plane.

10. The organic light emitting display device of claim 1, further comprising, on the pixel electrode, an intermediate layer including a light emitting layer and an opposite electrode formed on the intermediate layer.

11. The organic light emitting display device of claim 1, a thickness of the second insulation layer being thicker than that of the first insulation layer.

12. A method of manufacturing an organic light emitting display device, the method comprising:

sequentially forming a semiconductor layer and a first conductive layer on and above a substrate and patterning the semiconductor layer and the first conductive layer into an active layer and source/drain areas of a thin film transistor, in a first mask process;

forming a first insulation layer on a structure of the first mask process, sequentially forming a second conductive layer and a third conductive layer on and above the first insulation layer, and simultaneously patterning the first insulation layer, the second conductive layer, and the third conductive layer into a gate lower electrode and a gate upper electrode of the thin film transistor, a lower electrode and an upper electrode of a fanout, and a pixel electrode, in a second mask process;

forming a second insulation layer on a structure of the second mask process and removing the second insulation layer to have part of the source/drain areas and part of the pixel electrode exposed, in a third mask process;

forming a fourth conductive layer on a structure of the third mask process and patterning the fourth conductive layer into source/drain electrodes of the thin film transistor, in a fourth mask process; and

forming a third insulation layer on a structure of the fourth mask process and removing the second insulation layer and the third insulation layer to have the pixel electrode exposed, in a fifth mask process.

13. The method of claim 12, the first lower electrode and the first upper electrode of a capacitor being simultaneously patterned, in the first mask process, with the active layer and the source/drain areas of the thin film transistor.

14. The method of claim 12, a first half-tone mask including a semi-transmissive portion formed at a position corresponding to the central portion of the active layer being used in the first mask process.

15. The method of claim 12, the second lower electrode and the second upper electrode of a capacitor being simultaneously patterned with the gate lower electrode and the gate upper electrode of the thin film transistor in the second mask process.

16. The method of claim 12, a second half-tone mask including a semi-transmissive portion formed at a position corresponding to the pixel electrode being used in the second mask process.

17. The method of claim 12, further comprising sequentially forming an intermediate layer including a light emitting layer, and an opposite layer, on a structure resulting from the fifth mask process.

18. The method of claim 12, the second conductive layer comprising at least one material selected from a group consisting of ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), and In2P3 (indium oxide).

19. The method of claim 12, the third conductive layer comprising at least one material selected from a group consisting of Ag (silver), Mg (magnesium), Al (aluminum), Pt (platinum), Pd (palladium), Au (gold), Ni (nickel), Nd (neodymium), Ir (iridium), Cr (chromium), Li (lithium), Ca (calcium), Mo (molybdenum), Ti (tin), W (tungsten), MoW (molybdenum-tungsten), and Al/Cu (aluminum/copper).

20. The method of claim 12, further comprising forming a buffer layer on the substrate.