Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

• US 20110109335A1
• Filed: 11/06/2009
• Published: 05/12/2011
• Est. Priority Date: 11/06/2009
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Rutigliano, Michael L., Ackerman, Christopher W., Sauciuc, Ioan, Gupta, Ashish X., Schroeder, Christopher R., Acikalin, Tolga, Maveety, James G., Shipley, James C.
• Granted Patent: US 9,347,987 B2
• Time in Patent Office: Days
• US Class Current: 324/750.08
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G01R 31/2642 Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
• CPC Class Codes: G01R 31/2875 related to heating
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Claims

1. An apparatus to temperature-control a semiconductive device, comprising:

a base plane, wherein the base plane includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;

a fluid supply structure including a supply-orifice cross section; and

fluid return structure including a return-orifice cross section, and wherein the supply-orifice cross section is greater than the return-orifice cross section; and

a die interface, wherein the die interface is a liquid-impermeable material.

2. The apparatus of claim 1, wherein the supply-orifice cross section is a plurality of orifices.

3. The apparatus of claim 1, wherein the supply-orifice cross section consists of a first supply hole and a subsequent supply hole and wherein the first supply hole and the subsequent supply hole are spaced apart by the return-orifice cross section.

4. The apparatus of claim 1, wherein the die interface has an aspect ratio (height-to-width) between 1.1:

1 and 2;

1.

5. The apparatus of claim 1, further wherein the base plane is part of a direct fluid-contact thermal block, and wherein the fluid supply structure including the supply-orifice cross section and the fluid return structure including the return-orifice cross section are a unit cell in an array of supply- and return orifices disposed in the base plane.

6. The apparatus of claim 1, further wherein the base plane is part of a direct fluid-contact thermal block, and wherein the fluid supply structure including the supply-orifice cross section and the fluid return structure including the return-orifice cross section are a unit cell and one-third of a unit block in an array of supply- and return orifices disposed in the base plane.

7. The apparatus of claim 1, wherein the base plane is part of a laminate structure of a plurality of laminate types that form a direct fluid-contact thermal block.

8. The apparatus of claim 1, wherein the base plane is part of a laminate structure of a plurality of planes that form a direct fluid-contact thermal block, and wherein the fluid supply structure including the supply-orifice cross section and the fluid return structure including the return-orifice cross section are one-third of a unit cell in an array of supply- and return orifices disposed in the base plane.

9. An apparatus to temperature-control a semiconductive device, comprising:

a first laminate type including a plurality of unit block perimeters;

a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;

a fluid supply structure including a supply-orifice cross section; and

fluid return structure including a return-orifice cross section, and wherein the supply-orifice cross section is greater than the return-orifice cross section;

a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure;

a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors;

a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and

a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums.

10. The apparatus of claim 9, further wherein:

the first laminate type is 5 mils (thousandths of an inch) thick and is a single layer;

the second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the second laminate type is 5 mils thick and includes a total of 4 layers;

the third laminate type is 10 mils thick and includes a total of nine layers;

the fourth laminate type is 10 mils thick and includes a total of nine layers;

the fifth laminate type is 10 mils thick and includes a total of five layers; and

the sixth laminate type is 10 mils thick and includes a total of two layers.

11. A method of testing a die comprising:

directing fluid flow against a die backside surface from a fluid-flow unit cell, the fluid-flow unit cell including;

a die interface surface;

a fluid-supply orifice of a cross-section first area; and

a fluid-return orifice of a cross-section second area, wherein the first area is larger than the second area;

and wherein the fluid flow is primarily constrained by at least one adjacent fluid-flow unit cell.

12. The method of claim 11, wherein the fluid-flow unit cell includes two supply orifices and one return orifice, and wherein fluid flow is perimeter supply.

13. The method of claim 11, further including heating the fluid flow with a resistive heater that is configured parallel to the die interface surface.

14. The method of claim 11, wherein directing fluid flow includes temperature-controlling the fluid flow before directing the fluid flow against the die backside.

15. The method of claim 11, further including:

monitoring a first temperature change a junction of the die; and

wherein directing the fluid flow causes a second temperature change at the die junction.

16. The method of claim 11, wherein the fluid-flow unit cell includes two supply orifices and one return orifice, wherein fluid flow is perimeter supply, the method further including:

heating the fluid flow with a resistive heater that is configured parallel to the die interface surface;

monitoring a first temperature change a junction of the die; and

wherein directing the fluid flow causes a second temperature change at the die junction.

17. The method of claim 11, wherein directing the fluid flow includes directing a fluid of a liquid and a gas.

18. The method of claim 11, wherein directing the fluid flow includes directing a fluid of a refrigerant including liquid phase and allowing a gas phase out the fluid-return orifice.

19. A chip-testing system comprising:

a device under test (DUT) footprint on a direct fluid-contact thermal block including an active surface and a backside surface;

an inner seal affixed to the direct fluid-contact thermal block, wherein the inner seal is configured to mate with encapsulation material of a DUT to form a pressurized inner cavity;

a gasket affixed to a package sealing block that houses the direct fluid-contact thermal block, wherein the gasket enables a pressurized outer cavity that encompasses the pressurized inner cavity; and

a thermal fluid porting block that can cause the direct fluid-contact thermal block to seal onto a DUT and that can remove a DUT by suction.

20. The chip-testing system of claim 19, wherein the direct fluid-contact thermal block comprises:

a base plane, wherein the base plane includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;

a fluid supply structure including a supply-orifice cross section;

fluid return structure including a return-orifice cross section; and

wherein the supply-orifice cross section is greater than the return-orifice cross; and

a die interface, wherein the die interface is the inner seal.

21. The chip-testing system of claim 19, further including a semiconductive device (the DUT) disposed on a mounting substrate and affixed to the mounting substrate with the encapsulation material.

22. The chip-testing system of claim 19, further including a resistive heater disposed in the direct fluid-contact thermal block.

23. The chip-testing system of claim 19, further including a controller wherein the controller includes pulse-width modulated H-bridge pump control.

24. The chip-testing system of claim 19, further including a controller wherein the controller includes proportional, integral, and derivative control and combinations thereof.

25. The chip-testing system of claim 19, further including a controller wherein the controller includes servo control.

26. The chip-testing system of claim 19, further including a coolant fluid that is a two-phase refrigerant.