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Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

  • US 20110109335A1
  • Filed: 11/06/2009
  • Published: 05/12/2011
  • Est. Priority Date: 11/06/2009
  • Status: Active Grant
First Claim
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1. An apparatus to temperature-control a semiconductive device, comprising:

  • a base plane, wherein the base plane includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;

    a fluid supply structure including a supply-orifice cross section; and

    fluid return structure including a return-orifice cross section, and wherein the supply-orifice cross section is greater than the return-orifice cross section; and

    a die interface, wherein the die interface is a liquid-impermeable material.

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