×

LEAD ASSEMBLY INCLUDING A POLYMER INTERCONNECT AND METHODS RELATED THERETO

  • US 20110112616A1
  • Filed: 01/13/2011
  • Published: 05/12/2011
  • Est. Priority Date: 08/31/2006
  • Status: Active Grant
First Claim
Patent Images

1. A lead assembly comprising:

  • a lead body extending from a proximal end portion to a distal end portion, the distal end portion comprising an interconnect including a polymer ring component mechanically coupled to a generally cylindrical ring component having an outer surface, wherein a portion of an inner surface of the polymer ring component is disposed over and in contact with the outer surface of the generally cylindrical ring component;

    at least one conductor extending within the lead body from the proximal end in a direction toward the distal end; and

    at least one electrode operatively coupled to the at least one conductor.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×