TRANSPARENT SUBSTRATE

• US 20110114160A1
• Filed: 04/17/2009
• Published: 05/19/2011
• Est. Priority Date: 04/24/2008
• Status: Active Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Hattori, Daisuke, Murashige, Takeshi, Sakata, Yoshimasa, Yamaoka, Takashi, Nagatsuka, Tatsuki
• Application Number:
  US12/988,716
• Publication Number:
  US 20110114160A1
• Time in Patent Office: Days
• US Class Current: 136/252
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 17/10 of synthetic resin
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C03C 17/3405 with at least two coatings of organic materials C03C17/36, C03C17/42 take precedence
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133302 Rigid substrates, e.g. inorganic substrates
• CPC Class Codes: G02F 2201/50 Protective arrangements
• CPC Class Codes: H05B 33/28 of translucent electrodes
• CPC Class Codes: H10K 77/10 Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick

Abstract

There is provided a transparent substrate which is excellent in dimensional stability, which significantly prevents the progress of a crack in an inorganic glass and the rupture of the inorganic glass, and which is excellent in flexibility. A transparent substrate according to an embodiment of the present invention includes: an inorganic glass having a thickness of 10 μm to 100 μm; and a resin layer on one side, or each of both sides, of the inorganic glass, wherein: a ratio of a total thickness of the resin layer to a thickness of the inorganic glass is 0.9 to 4; the resin layer has a modulus of elasticity at 25° C. of 1.5 GPa to 10 GPa; and the resin layer has a fracture toughness value at 25° C. of 1.5 MPa·m^1/2 to 10 MPa·m^1/2.

Claims

1. A transparent substrate, comprising:

an inorganic glass having a thickness of 10 μ

m to 100 μ

m; and

a resin layer on one side, or each of both sides, of the inorganic glass,

wherein;

a ratio of a total thickness of the resin layer to a thickness of the inorganic glass is 0.9 to 4;

the resin layer has a modulus of elasticity at 25°

C. of 1.5 GPa to 10 GPa; and

the resin layer has a fracture toughness value at 25°

C. of 1.5 MPa·

m^1/2 to 10 MPa·

m^1/2.

2. A transparent substrate according to claim 1, wherein the resin layer contains a resin, and the resin has a glass transition temperature of 150°

C. to 350°

C.

3. A transparent substrate according to claim 1, wherein the resin layer is obtained by applying a solution of a thermoplastic resin to a surface of the inorganic glass.

4. A transparent substrate according to claim 1, further comprising a coupling agent layer on the inorganic glass.

5. A transparent substrate according to claim 4, wherein the coupling agent layer comprises a coupling agent layer obtained by curing an amino group-containing coupling agent, an epoxy group-containing coupling agent, or an isocyanate group-containing coupling agent, and the resin layer contains a thermoplastic resin containing an ester bond.

6. A transparent substrate according to claim 4, wherein the coupling agent layer comprises a coupling agent layer obtained by curing an epoxy group-terminated coupling agent, and the resin layer contains a thermoplastic resin having a hydroxyl group at any one of its terminals.

7. A transparent substrate according to claim 1, wherein the inorganic glass and the resin layer are placed through an adhesion layer, and the adhesion layer has a thickness of 10 μ

m or less.

8. A transparent substrate according to claim 4, wherein the coupling agent layer and the resin layer are placed through an adhesion layer, and the adhesion layer has a thickness of 10 μ

m or less.

9. A transparent substrate according to claim 1, wherein the transparent substrate has a total thickness of 150 μ

m or less.

10. A transparent substrate according to claim 1, wherein the transparent substrate is used as a substrate for a display device or solar cell.

11. A display device comprising the transparent substrate according to claim 1.

12. A solar cell comprising the transparent substrate according to claim 1.