METHOD FOR PACKAGING TARGET MATERIAL AND METHOD FOR MOUNTING TARGET

• US 20110114480A1
• Filed: 11/12/2010
• Published: 05/19/2011
• Est. Priority Date: 11/13/2009
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Sato, Keiji, Takayama, Toru, Yamazaki, Shunpei
• Granted Patent: US 8,753,491 B2
• Time in Patent Office: Days
• US Class Current: 204/298.13
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

It is an object to provide a method for packaging a target material with which a thin film that is less contaminated with an impurity in the air such as a compound containing a hydrogen atom can be formed. In addition, it is an object to provide a method for mounting a target with which a thin film that is less contaminated with an impurity can be formed. In order to achieve the objects, a target material in a target is not exposed to the air and kept sealed after being manufactured until a deposition apparatus on which the target is mounted is evacuated.

Claims

1. A packaged sputtering target comprising:

a backing plate including a mounting portion for a placement portion;

a sintered body fixed to the backing plate; and

a package attached to the backing plate so as to surround the sintered body without covering the mounting portion,

wherein an inside of the package is filled with a dry air.

2. The packaged sputtering target according to claim 1, wherein the inside of the package is filled with a gas whose dew point is less than or equal to −

40°

C.

3. The packaged sputtering target according to claim 1, wherein the sintered body comprises metal oxide.

4. The packaged sputtering target according to claim 3, wherein the metal oxide comprises indium, gallium, and zinc.

5. The packaged sputtering target according to claim 1, wherein the sintered body comprises metal.

6. The packaged sputtering target according to claim 5, wherein the metal comprises at least one of Al, Cu, Cr, Ta, Ti, Mo, and W.

7. A method for packaging a sputtering target, comprising:

fixing a sintered body to a backing plate including a mounting portion for a placement portion in a dry atmosphere in which dew point is less than or equal to −

40°

C.; and

attaching a package to the backing plate so as to surround the sintered body without covering the mounting portion in the dry atmosphere in which the dew point is less than or equal to −

40°

C.

8. A method for mounting a packaged sputtering target, comprising:

storing a target material in a package without covering a mounting portion for a placement portion in a dry atmosphere in which dew point is less than or equal to −

40°

C.;

mounting the target material stored in the package on the placement portion in a deposition chamber of a deposition apparatus;

evacuating the deposition chamber; and

detaching the package in the deposition chamber after the evacuating step.