SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE
First Claim
1. A solid-state imaging device, comprising:
- a photoelectric conversion portion that is provided above an imaging surface of a substrate; and
a plurality of readout circuit portions that are provided below the photoelectric conversion portion on the imaging surface;
whereinthe photoelectric conversion portion includes a photoelectric conversion film that receives incident light and produces a signal charge, and a first electrode and a second electrode that sandwich the photoelectric conversion film,the first electrode, the photoelectric conversion film, and the second electrode are sequentially layered upward on the imaging surface,each of the readout circuit portions includes a readout circuit that is electrically connected with the first electrode and reads out the signal charge produced by the photoelectric conversion portion, and a ground electrode that is grounded, andthe ground electrode is interposed between the readout circuit and the first electrode on the imaging surface.
2 Assignments
0 Petitions
Accused Products
Abstract
A solid-state imaging device includes a photoelectric conversion portion that is provided above an imaging surface of a substrate, and a plurality of readout circuit portions that are provided below the photoelectric conversion portion on the imaging surface. The photoelectric conversion portion includes a photoelectric conversion film that receives incident light and produces a signal charge, and a first electrode and a second electrode that sandwich the photoelectric conversion film, and the first electrode, the photoelectric conversion film, and the second electrode are sequentially layered upward on the imaging surface. Further, each of the readout circuit portions includes a readout circuit that is electrically connected with the first electrode and reads out the signal charge produced by the photoelectric conversion portion, and a ground electrode that is grounded, and the ground electrode is interposed between the readout circuit and the first electrode on the imaging surface.
20 Citations
8 Claims
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1. A solid-state imaging device, comprising:
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a photoelectric conversion portion that is provided above an imaging surface of a substrate; and a plurality of readout circuit portions that are provided below the photoelectric conversion portion on the imaging surface;
whereinthe photoelectric conversion portion includes a photoelectric conversion film that receives incident light and produces a signal charge, and a first electrode and a second electrode that sandwich the photoelectric conversion film, the first electrode, the photoelectric conversion film, and the second electrode are sequentially layered upward on the imaging surface, each of the readout circuit portions includes a readout circuit that is electrically connected with the first electrode and reads out the signal charge produced by the photoelectric conversion portion, and a ground electrode that is grounded, and the ground electrode is interposed between the readout circuit and the first electrode on the imaging surface. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a solid-state imaging device comprising the step of:
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manufacturing a solid-state imaging device in which a photoelectric conversion portion is provided above an imaging surface of a substrate and a readout circuit portion is provided below the photoelectric conversion portion; wherein the step of manufacturing a solid-state imaging device includes the steps of forming the photoelectric conversion portion, and forming the readout circuit portion, in the step of forming the photoelectric conversion portion, a first electrode, a photoelectric conversion film that receives incident light and produces a signal charge, and a second electrode are sequentially formed to be layered in such a manner that the first electrode and the second electrode sandwich the photoelectric conversion film, above the imaging surface, and in the step of forming the readout circuit portion, the readout circuit portion and a ground electrode that is grounded are formed in a manner that the ground electrode is interposed between a readout circuit that is electrically connected with the first electrode and reads out the signal charge produced by the photoelectric conversion portion and the first electrode.
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8. An electronic device, comprising:
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a solid-state imaging device that includes a photoelectric conversion portion provided above an imaging surface of a substrate and a readout circuit portion provided below the photoelectric conversion portion on the imaging surface;
whereinthe photoelectric conversion portion includes a photoelectric conversion film that receives incident light and produces a signal charge, and a first electrode and a second electrode that sandwich the photoelectric conversion film, the first electrode, the photoelectric conversion film, and the second electrode are sequentially layered upward on the imaging surface, the readout circuit portion includes a readout circuit that is electrically connected with the first electrode and reads out the signal charge produced by the photoelectric conversion portion, and a ground electrode that is grounded, and the ground electrode is interposed between the readout circuit and the first electrode on the imaging surface.
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Specification