ACOUSTIC DEVICE WITH LOW ACOUSTIC LOSS PACKAGING
First Claim
1. A device, comprising:
- a first substrate having a first aperture therethrough from a first side of the first substrate to a second side of the first substrate;
a first semiconductor die having at least a first acoustic transducer, the first semiconductor die being provided on the first side of the first substrate such that the first acoustic transducer is aligned with the first aperture in the first substrate;
a second substrate having a second aperture therethrough from a first side of the second substrate to a second side of the second substrate;
a second semiconductor die having at least a second acoustic transducer, the second semiconductor die being provided on the first side of the second substrate such that the second acoustic transducer is aligned with the second aperture in the second substrate; and
a dual in-line package having a recess therein;
wherein the first and second substrates are mounted on the dual in-line package such that the second substrate is adjacent to, and in parallel with, the first substrate,wherein the first sides of the first and second substrates, and the recess of the dual in-line package, together define a cavity, andwherein the first and second semiconductor dies are disposed in the cavity.
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Accused Products
Abstract
A device includes: a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate; a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and a dual in-line package having a recess formed therein. The substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and the semiconductor die is disposed between the first side of the substrate and the bottom surface of the recess in the dual in-line package.
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Citations
20 Claims
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1. A device, comprising:
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a first substrate having a first aperture therethrough from a first side of the first substrate to a second side of the first substrate; a first semiconductor die having at least a first acoustic transducer, the first semiconductor die being provided on the first side of the first substrate such that the first acoustic transducer is aligned with the first aperture in the first substrate; a second substrate having a second aperture therethrough from a first side of the second substrate to a second side of the second substrate; a second semiconductor die having at least a second acoustic transducer, the second semiconductor die being provided on the first side of the second substrate such that the second acoustic transducer is aligned with the second aperture in the second substrate; and a dual in-line package having a recess therein; wherein the first and second substrates are mounted on the dual in-line package such that the second substrate is adjacent to, and in parallel with, the first substrate, wherein the first sides of the first and second substrates, and the recess of the dual in-line package, together define a cavity, and wherein the first and second semiconductor dies are disposed in the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device, comprising:
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a substrate having an aperture therethrough from a first side of the substrate to a second side of the substrate; a semiconductor die having an acoustic transducer, the semiconductor die being provided on the first side of the substrate such that the acoustic transducer is aligned with the aperture in the substrate; and a dual in-line package having a recess formed therein, wherein the substrate is disposed such that the first side of the substrate faces the recess of the dual in-line package, and wherein the semiconductor die is disposed between the first side of the substrate and a bottom surface of the recess in the dual in-line package. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A packaged device, comprising:
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a substrate having a first side and a second side opposite the first side; a semiconductor die having an acoustic device, the semiconductor die being disposed on the first side of the substrate; and a packaging structure; wherein the semiconductor die having the acoustic device is disposed in a cavity defined by the substrate and the packaging structure. - View Dependent Claims (17, 18, 19, 20)
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Specification