SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
First Claim
1. A semiconductor device package, comprising:
- a circuit substrate including;
a carrying surface;
a bottom surface opposite the carrying surface; and
a pad;
an electronic device disposed adjacent to the carrying surface and electrically connected to the circuit substrate;
an encapsulant disposed adjacent to the carrying surface and encapsulating the electronic device, the encapsulant comprising a center portion and a peripheral portion surrounding the center portion, wherein;
a thickness of the peripheral portion is less than a thickness of the center portion;
an opening exposing the pad of the circuit substrate is formed in the peripheral portion; and
a conductive layer conformally covering the encapsulant and traversing the opening to connect to the pad of the circuit substrate.
1 Assignment
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Accused Products
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive layer. The substrate includes a carrying surface, an opposing bottom surface, and a pad. The device is disposed adjacent to the carrying surface and is electrically connected to the substrate. The encapsulant is disposed adjacent to the carrying surface, encapsulates the device, and includes a center portion and a surrounding peripheral portion that is less thick than the center portion. An opening exposing the pad is formed in the peripheral portion. The conductive layer conformally covers the encapsulant and traverses the opening to connect to the pad.
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Citations
20 Claims
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1. A semiconductor device package, comprising:
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a circuit substrate including; a carrying surface; a bottom surface opposite the carrying surface; and a pad; an electronic device disposed adjacent to the carrying surface and electrically connected to the circuit substrate; an encapsulant disposed adjacent to the carrying surface and encapsulating the electronic device, the encapsulant comprising a center portion and a peripheral portion surrounding the center portion, wherein; a thickness of the peripheral portion is less than a thickness of the center portion; an opening exposing the pad of the circuit substrate is formed in the peripheral portion; and a conductive layer conformally covering the encapsulant and traversing the opening to connect to the pad of the circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a semiconductor device package, comprising:
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providing a circuit substrate strip including; a carrying surface; a bottom surface opposite the carrying surface; and a circuit substrate; disposing an electronic device adjacent to the carrying surface, wherein the electronic device is bonded to the circuit substrate; forming an encapsulant disposed adjacent to the carrying surface and encapsulating the electronic device; performing a half-cutting of the encapsulant along a border of the circuit substrate to form a peripheral portion of the encapsulant extending along the border of the circuit substrate, wherein a thickness of the peripheral portion is less than a thickness of a center portion of the encapsulant; forming an opening in the peripheral portion to expose a pad of the circuit substrate; and forming a conductive layer to conformally cover the encapsulant, wherein the conductive layer is connected to the pad of the circuit substrate through the opening. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification