Camera module having lens mount with ir filter

• US 20110115918A1
• Filed: 01/18/2011
• Published: 05/19/2011
• Est. Priority Date: 12/08/1999
• Status: Abandoned Application

• Current Assignee: Amkor Technology Incorporated
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Application Number:
  US12/930,884
• Publication Number:
  US 20110115918A1
• Time in Patent Office: Days
• US Class Current: 348/164
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1-13. -13. (canceled)

14. A camera module comprising:

a substrate;

an image sensor coupled to the substrate;

a lens mount coupled to the substrate;

an infrared filter coupled to the lens mount; and

a lens barrel comprising at least one lens coupled to the lens mount.

15. The camera module of claim 14 further comprising:

a means for electrically connecting the camera module to a larger substrate.

16. The camera module of claim 15 wherein the means for electrically connecting comprises a ball grid array.

17. The camera module of claim 15 wherein the image sensor and the lens mount are coupled to a first surface of the substrate and wherein the means for electrically connecting is coupled to a second surface of the substrate.

18. The camera module of claim 14 wherein the camera module is mounted on a larger substrate.

19. The camera module of claim 14 wherein the camera module is electrically connected to a larger substrate.

20. The camera module of claim 14 further comprising an adhesive layer coupling the lens mount to the substrate.

21. The camera module of claim 20 wherein the lens mount is attached to a periphery of a first surface of the substrate by the adhesive layer.

22. The camera module of claim 14 wherein the at least one lens focuses light on an active area of the image sensor.

23. The camera module of claim 22 wherein rotation of the lens barrel moves the at least one lens relative to the active area.

24. The camera module of claim 14 wherein bond pads of the image sensor are coupled to traces of the substrate.

25. The cameral module of claim 14 further comprising bond wires coupling bond pads of the image sensor to traces of the substrate.

26. A camera module comprising:

a substrate;

an image sensor comprising an active area for receiving light, the image sensor being coupled to a first surface of the substrate;

a lens mount coupled to the first surface of the substrate, the lens mount comprising a threaded interior cylindrical surface defining an aperture;

an infrared filter coupled to the lens mount; and

a lens barrel comprising at least one lens in the aperture of the lens mount.

27. The camera module of claim 26 further comprising:

a land grid array for electrically connecting the camera module to a larger substrate.

28. The camera module of claim 26 wherein a longitudinal axis of the aperture of the lens mount is perpendicular to a plane parallel to the active area of the image sensor.

29. The camera module of claim 26 wherein the lens barrel comprises a threaded exterior cylindrical surface.

30. The camera module of claim 29 wherein the threaded exterior cylindrical surface of the lens barrel is threadedly attached to the threaded interior cylindrical surface of the lens mount.

31. The camera module of claim 26 wherein rotation of the lens barrel moves the lens barrel relative to the image sensor.

32. A camera module comprising:

a substrate;

an image sensor comprising an active area, the image sensor being coupled to the substrate;

bond wires coupling bond pads of the image sensor to traces of the substrate;

a lens mount;

an adhesive layer coupling the lens mount to the substrate;

an infrared filter coupled to the lens mount;

a lens barrel coupled to the lens mount, the lens barrel comprising at least one lens.

33. The camera module of claim 32 further comprising an adhesive coupling the infrared filter to the lens mount.