RF PACKAGE

• US 20110116237A1
• Filed: 11/03/2010
• Published: 05/19/2011
• Est. Priority Date: 11/15/2009
• Status: Active Grant

• Current Assignee: Microsemi Corporation (Microchip Technology Incorporated)
• Original Assignee: Microsemi Corporation (Microchip Technology Incorporated)
• Inventors: Samples, Benjamin A.
• Granted Patent: US 8,410,601 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/492 Bases or plates or solder therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/39 Structure, shape, material or disposition of the strap connectors after the connecting process
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper surface of the substrate to tapered lower surfaces of the cover. The cover includes a recess to receive the substrate. The recess includes stress distribution surface areas to engage and press outer edge portions of opposite sides of the substrate against a base plate or heat sink. The tapered lower surfaces of the cover engage with and press against the stepped source leads when securing the RF package to the base plate or heat sink using one or more fasteners or bolts. The cover includes structural features to improve preferential deformation when a mounting force is applied.

Claims

1. An RF package comprising:

a substrate mountable on a base plate;

a non-conductive cover overlying the substrate and including;

a recess configured to receive the substrate, the recess forming a stress distribution surface area to engage and press outer edge portions of opposite sides of the substrate against the base plate;

one or more tapered lower surfaces extending from the recess toward outer edge portions of the cover; and

one or more stepped source leads extending from at least one of a pair of opposite sides of an upper surface of the substrate to the one or more tapered lower surfaces of the cover.

2. The RF package of claim 1, wherein each of the one or more stepped source leads includes:

a first section coupled to the upper surface of the substrate, the upper surface of the substrate defining a horizontal dimension of the first section;

a second section extending in a slanted direction from the first section at an angle relative to the horizontal dimension of the first section; and

a third section extending from the second section at an angle relative to the slanted direction of the second section.

3. The RF package of claim 2, wherein the first, second, and third sections form a contiguous stepped source lead located beneath the cover.

4. The RF package of claim 2, wherein the one or more tapered lower surfaces of the cover are structured to engage with and press against the third section of the one or more stepped source leads.

5. The RF package of claim 2, wherein the recess includes one or more notches disposed at outer edges thereof, the one or more notches structured to provide:

stress concentration outwardly toward edges of the cover; and

deformation of the cover about the first and second sections of the one or more stepped source leads.

6. The RF package of claim 1, further comprising:

one or more gate and drain leads extending from at least one of a pair of opposite sides of an upper surface of the substrate;

one or more dies disposed on the substrate; and

one or more conductors electrically coupling the one or more gate leads, drain leads, and stepped source leads to the one or more dies.

7. The RF package of claim 6, further comprising:

a cavity disposed within the cover to receive the one or more dies, the one or more conductors, and at least portions of the one or more gate leads, drain leads, and stepped source leads.

8. The RF package of claim 7, wherein the cover includes:

a first section having a first thickness between the cavity and the top surface of the cover to provide rigidity to the central portion of the cover;

one or more additional sections having a second thickness between the cavity and the top surface of the cover, the second thickness less than the first thickness; and

a curved section connecting the first section to the one or more additional sections,

wherein the one or more additional sections and the curved section are configured to evenly distribute stress of the cover during preferential deformation thereof when securing the one or more stepped source leads and the substrate to the base plate.

9. The RF package of claim 1, wherein the base plate is a heat sink attachable to the one or more stepped source leads.

10. The RF package of claim 1, wherein the cover comprises a material having resistance to creep, high electrical insulation, high yield strength and low dielectric loss.

11. The RF package of claim 1, further comprising one or more bolt holes arranged in the cover and aligned with corresponding openings in the one or more stepped source leads, the one or more bolt holes configured to receive one or more bolts to secure the substrate and the one or more stepped source leads to the base plate.