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METHODS OF FORMING ELECTRONIC DEVICES

  • US 20110117490A1
  • Filed: 06/28/2010
  • Published: 05/19/2011
  • Est. Priority Date: 11/19/2009
  • Status: Active Grant
First Claim
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1. A method of forming an electronic device, comprising:

  • (a) providing a semiconductor substrate comprising one or more layers to be patterned;

    (b) applying a first layer of a photosensitive composition over the one or more layers to be patterned, wherein the first photosensitive composition comprises a first resin component and a photoactive component;

    (c) exposing the first layer to activating radiation through a patterned photomask;

    (d) developing the exposed first layer to form a resist pattern;

    (e) heat treating the resist pattern in a hardbake process;

    (f) treating the hardbaked resist pattern with a material effective to make alkaline a surface of the resist pattern;

    (g) applying a second layer of a thermally sensitive composition in contact with the alkaline surface of the resist pattern, the second composition comprising a second resin component and a thermal acid generator;

    (h) heating the second layer of the thermally sensitive composition to a temperature effective for the thermal acid generator to generate an acid; and

    (i) developing the heated second layer.

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