METHODS OF FORMING ELECTRONIC DEVICES
First Claim
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1. A method of forming an electronic device, comprising:
- (a) providing a semiconductor substrate comprising one or more layers to be patterned;
(b) applying a first layer of a photosensitive composition over the one or more layers to be patterned, wherein the first photosensitive composition comprises a first resin component and a photoactive component;
(c) exposing the first layer to activating radiation through a patterned photomask;
(d) developing the exposed first layer to form a resist pattern;
(e) heat treating the resist pattern in a hardbake process;
(f) treating the hardbaked resist pattern with a material effective to make alkaline a surface of the resist pattern;
(g) applying a second layer of a thermally sensitive composition in contact with the alkaline surface of the resist pattern, the second composition comprising a second resin component and a thermal acid generator;
(h) heating the second layer of the thermally sensitive composition to a temperature effective for the thermal acid generator to generate an acid; and
(i) developing the heated second layer.
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Abstract
Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.
401 Citations
10 Claims
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1. A method of forming an electronic device, comprising:
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(a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) applying a first layer of a photosensitive composition over the one or more layers to be patterned, wherein the first photosensitive composition comprises a first resin component and a photoactive component; (c) exposing the first layer to activating radiation through a patterned photomask; (d) developing the exposed first layer to form a resist pattern; (e) heat treating the resist pattern in a hardbake process; (f) treating the hardbaked resist pattern with a material effective to make alkaline a surface of the resist pattern; (g) applying a second layer of a thermally sensitive composition in contact with the alkaline surface of the resist pattern, the second composition comprising a second resin component and a thermal acid generator; (h) heating the second layer of the thermally sensitive composition to a temperature effective for the thermal acid generator to generate an acid; and (i) developing the heated second layer. - View Dependent Claims (2, 4, 5, 7, 8, 9)
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- 6. The method of claim 6, wherein treating the resist pattern with the material effective to make alkaline a surface of the resist pattern comprises sequentially treating the resist pattern with a quaternary ammonium hydroxide solution followed by treating the resist pattern with the primary or secondary amine.
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10. A coated semiconductor substrate, comprising:
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a semiconductor substrate comprising one or more layers to be patterned; a resist pattern over the one or more layers to be patterned, the resist pattern having an alkaline surface; and a layer of a thermally sensitive composition in contact with the alkaline surface of the resist pattern, the second composition comprising a second resin component and a thermal acid generator.
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Specification