CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER
First Claim
1. A manufacturing method for a circuit member, comprising the steps of:
- providing a lead frame material made from a rolled copper plate or a rolled copper-alloy plate, the lead frame material including a die pad, a lead part adapted to be electrically connected with a semiconductor chip to be mounted on the die pad, and an outer frame configured to support the die pad and the lead part;
forming a roughened face, having an average roughness Ra of 0.3 μ
m or greater, on a surface in a resin sealing region of the lead frame material by using a micro-etching liquid mainly containing hydrogen peroxide and sulfuric acid, the resin sealing region being adapted to be sealed by a resin together with the semiconductor chip mounted on the die pad; and
forming a two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order, or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order, on a whole surface of the lead frame material in which the roughened face is partially formed.
0 Assignments
0 Petitions
Accused Products
Abstract
A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
16 Citations
10 Claims
-
1. A manufacturing method for a circuit member, comprising the steps of:
-
providing a lead frame material made from a rolled copper plate or a rolled copper-alloy plate, the lead frame material including a die pad, a lead part adapted to be electrically connected with a semiconductor chip to be mounted on the die pad, and an outer frame configured to support the die pad and the lead part; forming a roughened face, having an average roughness Ra of 0.3 μ
m or greater, on a surface in a resin sealing region of the lead frame material by using a micro-etching liquid mainly containing hydrogen peroxide and sulfuric acid, the resin sealing region being adapted to be sealed by a resin together with the semiconductor chip mounted on the die pad; andforming a two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order, or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order, on a whole surface of the lead frame material in which the roughened face is partially formed. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A manufacturing method for a circuit member, comprising the steps of:
-
providing a lead frame material made from a rolled copper plate or a rolled copper-alloy plate, the lead frame material including a die pad, a lead part adapted to be electrically connected via bonding wire with a semiconductor chip to be mounted on the die pad, and an outer frame configured to support the die pad and the lead part; forming a single plated layer composed of an Ag plated layer, a two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order, or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order, on a surface of the die pad opposed to the semiconductor chip as well as on a portion, to be connected with the bonding wire, of a surface of the lead part; and forming a roughened face having an average roughness Ra of 0.3 μ
m or greater on a portion, on which no plated layer is formed, of a surface in a resin sealing region of the lead frame material by using a micro-etching liquid mainly containing hydrogen peroxide and the sulfuric acid, the resin sealing region being adapted to be sealed by a resin, together with the semiconductor chip located on the die pad and the bonding wire. - View Dependent Claims (7, 8, 9, 10)
-
Specification