Measuring Apparatus

• US 20110119009A1
• Filed: 01/18/2011
• Published: 05/19/2011
• Est. Priority Date: 10/11/2006
• Status: Active Grant

• Current Assignee: Adrian Kiermasz, Robert John Wilby
• Original Assignee: Adrian Kiermasz, Robert John Wilby
• Inventors: KIERMASZ, Adrian, Wilby, Robert John
• Granted Patent: US 8,200,447 B2
• Time in Patent Office: Days
• US Class Current: 702/81
• CPC Class Codes: G01G 19/00 Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups electric measuring arrangements involving comparison with a reference value G01R17/00

Abstract

Measuring apparatus for monitoring the position of the centre of mass of a semiconductor wafer is disclosed. The apparatus includes a wafer support (14) with a ledge for supporting an edge of a wafer (2) when it is lifted at a detection point by a probe (16). The probe (16) is connected to a force sensor (18) which senses a force due to a moment of the wafer about a fulcrum (4) on the wafer support (14). Moment measurements are taken at a plurality of detection points and a processing unit calculates the position of the centre of mass from the moment measurements. Changes in wafer mass distribution (e.g. due to faulty treatment steps) which cause movement of the centre of mass can be detected.

Claims

1. Apparatus for monitoring a fabrication process of a semiconductor wafer, the apparatus having:

a pivot element for providing a plurality of fulcrums about which the wafer is pivotable; and

a weighing unit arranged to measure a force at each of a plurality of detection points on the wafer, the force at each detection point being due to a moment of the wafer about a respective fulcrum.

2. Apparatus according to claim 1 including a processing unit arranged to calculate the moment at each detection point.

3. Apparatus according to claim 2, wherein the processing unit is arranged to calculate the position of the wafer'"'"'s centre of mass from the calculated moments.

4. Apparatus according to claim 1, wherein the pivot element and weighing unit are arranged to support fully the weight of the wafer.

5. Apparatus according to claim 4, wherein the pivot element has two separated support elements for contacting the wafer and defining a pivot axis therebetween and the weighing unit includes a probe connected to a third support element which forms a triangular configuration with the support elements of the pivot element, whereby the weighing unit is arranged to detect the moment of the wafer about the pivot axis defined by the other two support points.

6. Apparatus according to claim 4, wherein each of three support points for the wafer are connected to the weighing unit to permit three moment measurements for a single position of the wafer relative to the support points.

7. Apparatus according to claim 4, wherein the pivot element includes an annular ledge arranged to lie under the outer edge of the wafer, such that, during detection, the wafer is pivotable about a point on its edge.

8. Apparatus according to claim 1, wherein the weighing unit includes a probe connected to a force sensing device, which is arranged to measure the force exerted on the probe due to the moment of the wafer about a pivot axis.

9. Apparatus according to claim 8, wherein the movement mechanism includes a tracking device arranged to determine the precise positional relationship between the pivot element and probe.

10. Apparatus according to claim 9, wherein the probe may be movable between detection points on the back of the wafer

11. Apparatus according to claim 1, wherein the pivot element is adapted to receive the wafer in a predetermined orientation.

12. Apparatus according to claim 1 including one or more monitoring devices arranged to determine local temperature, pressure and humidity to enable measurements to be adjusted for atmospheric buoyancy.