CHARGED PARTICLE BEAM DRAWING APPARATUS AND ELECTRICAL CHARGING EFFECT CORRECTION METHOD THEREOF
First Claim
1. A charged particle beam drawing apparatus, comprising:
- a drawing portion for drawing patterns corresponding to figures included in a drawing data, on a resist of a workpiece by applying a charged particle beam to the resist, the resist being applied to an upper surface of the workpiece;
a pattern area density distribution calculating portion for calculating a pattern area density distribution of patterns drawn by the charged particle beam;
a dose distribution calculating portion for calculating a dose distribution on the basis of the pattern area density distribution and a backscattering ratio of charged particles in the resist;
an irradiation amount distribution calculating portion for calculating an irradiation amount distribution, the irradiation amount distribution being a product of the pattern area density distribution by the dose distribution;
a fogging charged particle amount distribution calculating portion for performing a convolution calculation of the irradiation amount distribution and a fogging charged particle distribution;
an irradiation time calculating portion for calculating an irradiation time of the charged particle beam for drawing the patterns;
an elapsed time calculating portion for calculating an elapsed time;
an electrical charging amount distribution calculating portion for calculating an electrical charging amount distribution of the resist of the workpiece, the resist of the workpiece being electrically charged by an irradiation of the charged particle beam;
a position deviation amount map calculating portion for performing a convolution calculation of the electrical charging amount distribution and a position deviation response function;
a central processing unit used for a calculation in the pattern area density distribution calculating portion, a calculation in the dose distribution calculating portion, a calculation in the irradiation amount distribution calculating portion, a calculation in the irradiation time calculating portion, a calculation in the elapsed time calculating portion and a calculation in the electrical charging amount distribution calculating portion; and
a high speed processing unit used for the calculation in the fogging charged particle amount distribution calculating portion and the calculation in the position deviation amount map calculating portion, wherein a processing speed of the high speed processing unit is higher than a processing speed of the central processing unit.
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Accused Products
Abstract
A charged particle beam drawing apparatus calculates a pattern area density distribution by using a central processing unit, calculates a dose distribution by using the central processing unit, calculates an irradiation amount distribution by using the central processing unit, performs a convolution calculation of the irradiation amount distribution and a fogging charged particle distribution by using a high speed processing unit, a processing speed of the high speed processing unit being higher than a processing speed of the central processing unit, calculates an irradiation time by using the central processing unit, calculates an elapsed time by using the central processing unit, calculates an electrical charging amount distribution by using the central processing unit, and performs a convolution calculation of the electrical charging amount distribution and a position deviation response function by using the high speed processing unit.
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Citations
10 Claims
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1. A charged particle beam drawing apparatus, comprising:
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a drawing portion for drawing patterns corresponding to figures included in a drawing data, on a resist of a workpiece by applying a charged particle beam to the resist, the resist being applied to an upper surface of the workpiece; a pattern area density distribution calculating portion for calculating a pattern area density distribution of patterns drawn by the charged particle beam; a dose distribution calculating portion for calculating a dose distribution on the basis of the pattern area density distribution and a backscattering ratio of charged particles in the resist; an irradiation amount distribution calculating portion for calculating an irradiation amount distribution, the irradiation amount distribution being a product of the pattern area density distribution by the dose distribution; a fogging charged particle amount distribution calculating portion for performing a convolution calculation of the irradiation amount distribution and a fogging charged particle distribution; an irradiation time calculating portion for calculating an irradiation time of the charged particle beam for drawing the patterns; an elapsed time calculating portion for calculating an elapsed time; an electrical charging amount distribution calculating portion for calculating an electrical charging amount distribution of the resist of the workpiece, the resist of the workpiece being electrically charged by an irradiation of the charged particle beam; a position deviation amount map calculating portion for performing a convolution calculation of the electrical charging amount distribution and a position deviation response function; a central processing unit used for a calculation in the pattern area density distribution calculating portion, a calculation in the dose distribution calculating portion, a calculation in the irradiation amount distribution calculating portion, a calculation in the irradiation time calculating portion, a calculation in the elapsed time calculating portion and a calculation in the electrical charging amount distribution calculating portion; and a high speed processing unit used for the calculation in the fogging charged particle amount distribution calculating portion and the calculation in the position deviation amount map calculating portion, wherein a processing speed of the high speed processing unit is higher than a processing speed of the central processing unit. - View Dependent Claims (2, 3, 4, 5)
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6. An electrical charging effect correction method of a charged particle beam drawing apparatus for drawing patterns corresponding to figures included in a drawing data, on a resist of a workpiece by applying a charged particle beam to the resist, the resist being applied to an upper surface of the workpiece, comprising:
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performing a calculation of a pattern area density distribution of patterns drawn by the charged particle beam, by using a central processing unit; performing a calculation of a dose distribution on the basis of the pattern area density distribution and a backscattering ratio of charged particles in the resist, by using the central processing unit; performing a calculation of an irradiation amount distribution by using the central processing unit, the irradiation amount distribution being a product of the pattern area density distribution by the dose distribution; performing a convolution calculation of the irradiation amount distribution and a fogging charged particle distribution, by using a high speed processing unit, wherein a processing speed of the high speed processing unit is higher than a processing speed of the central processing unit; performing a calculation of an irradiation time of the charged particle beam for drawing the patterns, by using the central processing unit; performing a calculation of an elapsed time by using the central processing unit; performing a calculation of an electrical charging amount distribution of the resist of the workpiece by using the central processing unit, the resist of the workpiece being electrically charged by an irradiation of the charged particle beam; and performing a convolution calculation of the electrical charging amount distribution and a position deviation response function, by using the high speed processing unit. - View Dependent Claims (7, 8, 9, 10)
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Specification