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LED package structure

  • US 20110121328A1
  • Filed: 05/05/2010
  • Published: 05/26/2011
  • Est. Priority Date: 11/26/2009
  • Status: Active Grant
First Claim
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1. An LED package structure, comprising:

  • a heatsink slug;

    a positive-electrode frame;

    a negative-electrode frame; and

    an LED module, being electrically connected with the positive-electrode frame and the negative-electrode frame;

    characterized in that;

    the LED module includes a plurality of LED chips, and the heatsink slug is provided, at its surface, with a plurality of cup-like recesses, where the plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess, and each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex configuration.

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