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Solid State Light Emitting Apparatus with Thermal Management Structures and Methods of Manufacturing

  • US 20110121333A1
  • Filed: 11/25/2009
  • Published: 05/26/2011
  • Est. Priority Date: 11/25/2009
  • Status: Active Grant
First Claim
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1. A method of packaging a solid state light emitting element, the method comprising:

  • mounting, to a thermally conductive component, a solid state light emitting element that includes first and second electrical connection points that are configured to be conductively engaged on a first side of a circuit structure; and

    electrically insulating the solid state light emitting element from the thermally conductive component to provide that electrical connections are arranged on the first side of the circuit structure and heat is conducted to a second side of the circuit structure that is opposite the first side of the circuit structure.

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