POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
First Claim
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1. A light emitting die package, comprising:
- a substrate having a first surface,a first conductive lead on the first surface that is insulated from the substrate by an insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, anda lead electrically connected to the first conductive lead and extending away from the first surface.
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Abstract
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
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Citations
16 Claims
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1. A light emitting die package, comprising:
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a substrate having a first surface, a first conductive lead on the first surface that is insulated from the substrate by an insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, and a lead electrically connected to the first conductive lead and extending away from the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification