METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT
First Claim
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1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
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Abstract
Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
58 Citations
20 Claims
- 1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
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6. (canceled)
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19. Electronic arrangement having an organic electronic structure, and a pressure-sensitive adhesive, the electronic structure being at least partly encapsulated by the pressure-sensitive adhesive, wherein the pressure-sensitive adhesive comprises polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes.
Specification