Microplate and methods for making the same
First Claim
1. A microplate comprising, in combination:
- a carrier formed of a rigid material and including a plate having a top face and a bottom face spaced from the top face in a direction, with the plate including an array of holes extending from the top face through the bottom face; and
a tape piece made of an embossable, thermo-conductive, and low mass material, with the tape piece including an upper surface and a lower surface spaced from the upper surface in the direction, with the tape piece further including an array of wells each extending in the direction away from the upper surface and each having an opening extending from the upper surface into the well, with the array of wells of the tape piece having a number and locations corresponding to the array of holes of the plate, with the openings of the array of wells of the tape piece having sizes corresponding to the array of holes of the plate, with the upper surface of the tape piece being bonded to the bottom face of the plate with the openings of the array of wells of the tape piece corresponding to the array of holes of the plate.
3 Assignments
0 Petitions
Accused Products
Abstract
A microplate (10) includes a carrier (12) having a plate (20) and an annular perimeter wall (30) to define a recess (34). An array of holes (26) extends through the plate (20). A tape piece (16), die cut from a flexible tape (60) includes an array of wells (54) each extending through and having an opening (56) extending into the well (54). The array of wells (54) has a number and locations corresponding to the array of holes (26). The openings (56) have sizes corresponding to the holes (26). An upper surface (50) of the tape piece (16) is abutted with and bonded to the bottom face (24) of the plate (20) with the openings (56) corresponding to the array of holes (26). The slideable receipt of an annular outer periphery (58) of the tape piece (16) insures that the array of wells (54) are aligned to correspond to the array of holes (26) as die cutting of tape piece (16) insures that the array of wells (54) are at consistent positions relative to the annular outer periphery (58).
18 Citations
20 Claims
-
1. A microplate comprising, in combination:
-
a carrier formed of a rigid material and including a plate having a top face and a bottom face spaced from the top face in a direction, with the plate including an array of holes extending from the top face through the bottom face; and a tape piece made of an embossable, thermo-conductive, and low mass material, with the tape piece including an upper surface and a lower surface spaced from the upper surface in the direction, with the tape piece further including an array of wells each extending in the direction away from the upper surface and each having an opening extending from the upper surface into the well, with the array of wells of the tape piece having a number and locations corresponding to the array of holes of the plate, with the openings of the array of wells of the tape piece having sizes corresponding to the array of holes of the plate, with the upper surface of the tape piece being bonded to the bottom face of the plate with the openings of the array of wells of the tape piece corresponding to the array of holes of the plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method for making a microplate comprising:
-
forming a carrier of a rigid material, with the carrier including a plate with a top face and a bottom face spaced from the top face in a direction, with the plate including an array of holes extending from the top face through the bottom face; cutting a tape piece made of an embossable, thermo-conductive, and low mass material, with the tape piece including an upper surface and a lower surface spaced from the upper surface in the direction, with the tape piece further including an array of wells each extending in the direction away from the upper surface and each having an opening extending from the upper surface into the well, with the openings of the array of wells of the tape piece having sizes corresponding to the array of holes of the plate, with the array of wells of the tape piece having a number and locations corresponding to the array of holes of the plate; and abutting and bonding the upper surface of the tape piece to the bottom face of the plate with the openings of the array of wells of the tape piece corresponding to the array of holes of the plate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification