SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

• US 20110124144A1
• Filed: 03/17/2009
• Published: 05/26/2011
• Est. Priority Date: 03/17/2009
• Status: Abandoned Application

• Current Assignee: ROTH & RAU AG (Meyer Burger Technology AG)
• Original Assignee: ROTH & RAU AG (Meyer Burger Technology AG)
• Inventors: Schlemm, Hermann, Uhlig, Matthias
• Application Number:
  US13/055,745
• Publication Number:
  US 20110124144A1
• Time in Patent Office: Days
• US Class Current: 438/57
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01L 31/02363 of the semiconductor body itself, e.g. textured active layers
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A substrate processing apparatus includes an evacuatable process chamber configured to receive a substrate carrier having at least one substrate, a plasma generating module, a gas feed, a gas discharge and a vapor etching module provided in the process chamber. A substrate processing method includes introducing a substrate carrier including at least one substrate into an evacuatable process chamber, generating a plasma in a plasma process using a plasma generating module in a gas or a gas mixture, performing a vapor etching of the at least one substrate before, after or alternatingly with the plasma process and performing at least one of a coating, etching, surface modification and cleaning of the substrate.

Claims

1-24. -24. (canceled)

25. A continuous substrate processing apparatus comprising:

at least one evacuatable process chamber configured to receive at least one substrate carrier having at least one substrate;

a plasma generating module;

at least one gas feed;

at least one gas discharge; and

a vapor etching module disposed in the process chamber.

26. The substrate processing apparatus as recited in claim 25, wherein the vapor etching module is an HF vapor etching module.

27. The substrate processing apparatus as recited in claim 25, further comprising an etching gas-resistant internal lining and an etching gas-resistant substrate carrier.

28. The substrate processing apparatus as recited in claim 25, wherein the vapor etching module includes a gas spray having a plurality of gas outlets distributed over an area of the process chamber.

29. The substrate processing apparatus as recited in claim 25, further comprising an etching vapor supply unit coupled to the vapor etching module.

30. The substrate processing apparatus as recited in claim 29, wherein the etching vapor supply unit includes at least one of a gas metering system and an etching vapor generating system having a temperature regulated space, the temperature-regulated space being configured to receive a liquid etching substance and to pass at least one carrier gas flow therethrough.

31. The substrate processing apparatus as recited in claim 25, wherein the plasma generating module includes at least one suppliable electrode disposed in the process chamber, the at least one suppliable electrode having a planar configuration.

32. The substrate processing apparatus as recited in claim 25, wherein the at least one substrate carrier includes at least one substrate support having a planar supporting region configured to support a circumferential region of at least one substrate.

33. The substrate processing apparatus as recited in claim 32, wherein the substrate support includes an opening within the supporting region.

34. The substrate processing apparatus as recited in claim 25, further comprising at least one internal volume reducing component disposed in the process chamber.

35. The substrate processing apparatus as recited in claim 25, wherein the substrate processing apparatus is configured to produce solar cells.

36. The substrate processing apparatus as recited in claim 25, further comprising at least one of a heating and a cooling device disposed in the process chamber or coupled to the process chamber.

37. A substrate processing method comprising:

introducing at least one substrate carrier including at least one substrate into at least one evacuatable process chamber;

generating a plasma in a plasma process using a plasma generating module in a gas or a gas mixture so as to provide at least one of a coating, etching, surface modification and cleaning of the substrate;

performing a vapor etching of the at least one substrate before, after or alternatingly with the plasma process.

38. The substrate processing method as recited in claim 37, wherein the vapor etching is performed using an HF-containing vapor.

39. The substrate processing method as recited in claim 37, wherein the vapor etching is performed so as to produce solar cells.

40. The substrate processing method as recited in claim 37, wherein the vapor etching includes an HF vapor etching step for etching PSG from a front side of the at least one substrate, and the plasma process includes plasma oxidation of one or more surface layers of the at least one substrate after the HF vapor etching step.

41. The substrate processing method as recited in claim 37, wherein the vapor etching includes an HF vapor etching step for etching PSG from a rear side of the at least one substrate, and the plasma process includes emitter rear-side etching of the at least one substrate in a plasma etching step after the HF vapor etching step.

42. The substrate processing method as recited in claim 40, wherein the vapor etching includes an additional vapor etching step using a vapor mixture including HF and O₃ for etching metal ions from the at least one substrate, the additional vapor etching step being after the HF vapor etching step.

43. The substrate processing method as recited in claim 41, wherein the vapor etching includes an additional vapor etching step using a vapor mixture including HF and O₃ for etching metal ions from the at least one substrate, the additional vapor etching step being after the HF vapor etching step.

44. The substrate processing method as recited in claim 40 wherein O₂ plasma cleaning is performed before the HF vapor etching step of the at least one substrate.

45. The substrate processing method as recited in claim 41 wherein O₂ plasma cleaning is performed after the emitter rear-side etching of the at least one substrate.

46. The substrate processing method as recited in claim 37 wherein the plasma process includes plasma oxidation of at least one surface layer of the at least one substrate and the vapor etching is performed after the plasma process is performed and includes an HF vapor etching of the at least one oxidized surface layer.

47. The substrate processing method as recited in claim 45 further comprising performing the plasma oxidation and the HF vapor etching of the oxidized surface layer more than once and alternatingly.

48. The substrate processing method as recited in claim 37 wherein an O₂ plasma cleaning is performed, and wherein the vapor etching includes an HF vapor etching step using HF-containing vapor and reactive oxygen, the HF vapor etching step being after the O₂ plasma cleaning.

49. The substrate processing method as recited in claim 37 wherein the vapor etching includes an HF vapor etching step performed so as to remove air oxide from at least one of a front side and a rear side of the at least one substrate, and wherein O₂ plasma cleaning of the at least one substrate is performed at least one of before and after the HF vapor etching step.