LATERALLY INTEGRATED MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING
First Claim
1. A microelectromechanical systems (MEMS) sensor device comprising:
- a substrate having a first side and a second side that opposes said first side;
a first sensor disposed on said first side of said substrate at a first location; and
a second sensor disposed on said first side of said substrate at a second location, said second sensor including a sense element, and said substrate including a cavity at said second location and extending through said substrate from said second side to expose said sense element to an environment external to said MEMS sensor device.
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Accused Products
Abstract
A microelectromechanical systems (MEMS) sensor device (20) includes a substrate (22) having sensors (24, 26) disposed on the same side (28) of the substrate (22) and laterally spaced apart from one another. The sensor (26) includes a sense element (56), and the substrate (22) includes a cavity (58) extending through the substrate (22) from the backside (30) of the substrate (22) to expose the sense element (56) to an external environment (54).
The sense element (56) is movable in response to a stimulus (52) from the environment (54) due to its exposure to the environment (54) via the cavity (58). Fabrication methodology (66) entails concurrently forming the sensors (24, 26) on substrate (22) by implementing MEMS process flow, followed by creating the cavity (58) through the substrate (22) to expose the sense element (56) to the environment (54).
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Citations
20 Claims
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1. A microelectromechanical systems (MEMS) sensor device comprising:
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a substrate having a first side and a second side that opposes said first side; a first sensor disposed on said first side of said substrate at a first location; and a second sensor disposed on said first side of said substrate at a second location, said second sensor including a sense element, and said substrate including a cavity at said second location and extending through said substrate from said second side to expose said sense element to an environment external to said MEMS sensor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:
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concurrently forming an electrode element and a sense element from a first material layer on a first side of a substrate, said electrode element positioned at a first location on said first side and said sense element laterally spaced apart from said electrode element and positioned at a second location on said first side; concurrently forming a movable element and a reference element spaced apart from said first side of said substrate, said movable element and said reference element being formed from a second material layer, said movable element functioning cooperatively with said electrode element to produce a first sensor, and said reference element overlying said sense element to produce a second sensor; and creating a cavity at said second location extending through said substrate from a second side of said substrate to expose said sense element to an environment external to said sensor system. - View Dependent Claims (14, 15, 16)
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17. A microelectromechanical systems (MEMS) sensor device comprising:
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a substrate having a first side and a second side that opposes said first side; a first sensor disposed on said first side at a first location; a second sensor disposed on said first side at a second location, said second sensor comprising a pressure sensor having a diaphragm, and said substrate including a cavity at said second location, said cavity extending through said substrate from said second side to expose said diaphragm to an environment external to said MEMS sensor device, and said diaphragm being movable in response to a pressure stimulus from said environment; and a cap coupled with said first side of said substrate to form a hermetically sealed chamber in which both of said first sensor and said pressure sensor are located. - View Dependent Claims (18, 19, 20)
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Specification