Semiconductor Devices and Methods for Making the Same
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate heavily doped with a dopant of a first conductivity type;
an epitaxial layer on the substrate, the epitaxial layer being lightly doped with a dopant of a first conductivity type with a concentration gradient;
a trench formed in the epitaxial layer, the trench containing a sidewall that is lightly doped with a dopant of a second conductivity type, a first insulating region in a lower portion of the trench and a second insulating region in an upper portion of the trench, the first and second insulating regions sandwiching a conductive or semiconductive layer;
a source layer contacting the upper surface of the epitaxial layer and the upper surface of the second insulating region; and
a drain contacting a bottom portion of the substrate.
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Abstract
Semiconductor devices and methods for making such devices that are especially suited for high-frequency applications are described. The semiconductor devices combine a SIT (or a junction field-effect transistor [JFET]) architecture with a PN super-junction structure. The SIT architecture can be made using a trench formation containing a gate that is sandwiched between thick dielectric layers. While the gate is vertically sandwiched between the two isolating regions in the trench, it is also connected to a region of one conductivity type of the super-junction structure, thereby allowing control of the current path of the semiconductor device. Such semiconductor devices have a lower specific resistance and capacitance relative to conventional planar gate and recessed gate SIT semiconductor devices. Other embodiments are described.
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Citations
23 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate heavily doped with a dopant of a first conductivity type; an epitaxial layer on the substrate, the epitaxial layer being lightly doped with a dopant of a first conductivity type with a concentration gradient; a trench formed in the epitaxial layer, the trench containing a sidewall that is lightly doped with a dopant of a second conductivity type, a first insulating region in a lower portion of the trench and a second insulating region in an upper portion of the trench, the first and second insulating regions sandwiching a conductive or semiconductive layer; a source layer contacting the upper surface of the epitaxial layer and the upper surface of the second insulating region; and a drain contacting a bottom portion of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 17)
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10. A semiconductor device, comprising:
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a semiconductor substrate heavily doped with a dopant of a first conductivity type; an epitaxial layer on the substrate, the epitaxial layer being lightly doped with a dopant of a first conductivity type with a concentration gradient; a contact region on the upper surface of the epitaxial layer, the contact region being heavily doped with a dopant of a first conductivity type; a trench formed in the epitaxial layer, the trench containing a sidewall that is lightly doped with a dopant of a second conductivity type to form a super-junction with the epitaxial layer, and the trench containing a gate electrically connected to the sidewall and insulated by upper and lower insulating regions in the trench; a source layer contacting the upper surface of the epitaxial layer and the upper surface of the upper insulating region; and a drain contacting a bottom portion of the substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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18. An electronic apparatus containing a semiconductor device, comprising:
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a semiconductor substrate heavily doped with a dopant of a first conductivity type; an epitaxial layer on the substrate, the epitaxial layer being lightly doped with a dopant of a first conductivity type with a concentration gradient; a trench formed in the epitaxial layer, the trench containing a sidewall that is lightly doped with a dopant of a second conductivity type, a first insulating region in a lower portion of the trench and a second insulating region in an upper portion of the trench, the first and second insulating regions sandwiching a conductive layer; a source layer contacting the upper surface of the epitaxial layer and the upper surface of the second insulating region; and a drain contacting a bottom portion of the substrate. - View Dependent Claims (19, 20)
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21. An electronic apparatus containing a semiconductor device, comprising:
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a semiconductor substrate heavily doped with a dopant of a first conductivity type; an epitaxial layer on the substrate, the epitaxial layer being lightly doped with a dopant of a first conductivity type with a concentration gradient; a contact region on the upper surface of the epitaxial layer, the contact region being heavily doped with a dopant of a first conductivity type; a trench formed in the epitaxial layer, the trench containing a sidewall that is lightly doped with a dopant of a second conductivity type to form a super-junction with the epitaxial layer, and the trench containing a gate electrically connected to the sidewall and insulated by upper and lower insulating regions in the trench; a source layer contacting the upper* surface of the epitaxial layer and the upper surface of the upper insulating region; and a drain contacting a bottom portion of the substrate. - View Dependent Claims (22, 23)
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Specification