Semiconductor Package and Manufacturing Methods Thereof
First Claim
Patent Images
1. A semiconductor package, comprising:
- a die having an active surface and an inactive surface;
a shield disposed over the inactive surface of the die;
a package body encapsulating the die and a first portion of the shield wherein a first surface of the package body is substantially coplanar with the active surface of the die; and
a redistribution layer disposed on the active surface of the die and on portions of the first surface of the package body.
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Abstract
A semiconductor package and manufacturing methods thereof are provided. In one embodiment, the semiconductor package includes a die, a shield, a package body, and a redistribution layer. The die has an active surface and an inactive surface. The shield is disposed over the inactive surface of the die. The package body encapsulates the die and a first portion of the shield, where a first surface of the package body is substantially coplanar with the active surface of the die. The redistribution layer is disposed on the active surface of the die and on portions of the first surface of the package body.
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Citations
20 Claims
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1. A semiconductor package, comprising:
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a die having an active surface and an inactive surface; a shield disposed over the inactive surface of the die; a package body encapsulating the die and a first portion of the shield wherein a first surface of the package body is substantially coplanar with the active surface of the die; and a redistribution layer disposed on the active surface of the die and on portions of the first surface of the package body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package, comprising:
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a die having an active surface; a shield extending over the die, the shield comprising a lateral section and a central section; a package body encapsulating the die but exposing the active surface, and encapsulating portions of the lateral section of the shield, the central section of the shield disposed on an exterior surface of the package body; and a redistribution layer disposed on the active surface of the die and a first surface of the package body. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing a semiconductor package, comprising:
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providing a die having an active surface; placing a metal structure over the die, the metal structure including a mesh defining a plurality of openings; encapsulating the metal structure and the die with an encapsulant such that the active surface of the die, portions of the metal structure, and portions of the encapsulant form a substantially coplanar surface, wherein the molding material traverses the plurality of openings to encapsulate the die; and forming a redistribution layer on the substantially coplanar surfacc, the redistribution layer electrically connected to the active surface of the die. - View Dependent Claims (19, 20)
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Specification