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Semiconductor Package and Manufacturing Methods Thereof

  • US 20110127654A1
  • Filed: 11/29/2010
  • Published: 06/02/2011
  • Est. Priority Date: 11/27/2009
  • Status: Abandoned Application
First Claim
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1. A semiconductor package, comprising:

  • a die having an active surface and an inactive surface;

    a shield disposed over the inactive surface of the die;

    a package body encapsulating the die and a first portion of the shield wherein a first surface of the package body is substantially coplanar with the active surface of the die; and

    a redistribution layer disposed on the active surface of the die and on portions of the first surface of the package body.

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