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Wireless power circuit board and assembly

  • US 20110127845A1
  • Filed: 06/03/2010
  • Published: 06/02/2011
  • Est. Priority Date: 11/30/2009
  • Status: Active Grant
First Claim
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1. A circuit board assembly comprises:

  • a multiple layer substrate;

    a wireless power transmitter control module supported by a layer of the multiple layer substrate;

    a wireless power coil assembly fabricated on an inner layer of the multiple layer substrate; and

    a plurality of integrated circuits (ICs) mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is;

    aligned to substantially overlap a coil of the wireless power coil assembly; and

    wirelessly powered by the wireless power transmitter control module via the coil.

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