Wireless power circuit board and assembly
First Claim
1. A circuit board assembly comprises:
- a multiple layer substrate;
a wireless power transmitter control module supported by a layer of the multiple layer substrate;
a wireless power coil assembly fabricated on an inner layer of the multiple layer substrate; and
a plurality of integrated circuits (ICs) mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is;
aligned to substantially overlap a coil of the wireless power coil assembly; and
wirelessly powered by the wireless power transmitter control module via the coil.
7 Assignments
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Accused Products
Abstract
A circuit board assembly includes a multiple layer substrate, a wireless power transmitter control module, a wireless power coil assembly, and a plurality of ICs. The wireless power transmitter control module is supported by a layer of the multiple layer substrate and the wireless power coil assembly is fabricated on an inner layer of the multiple layer substrate. The ICs are mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is aligned to substantially overlap a coil of the wireless power coil assembly and is wirelessly powered by the wireless power transmitter control module via the coil.
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Citations
20 Claims
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1. A circuit board assembly comprises:
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a multiple layer substrate; a wireless power transmitter control module supported by a layer of the multiple layer substrate; a wireless power coil assembly fabricated on an inner layer of the multiple layer substrate; and a plurality of integrated circuits (ICs) mounted on an outer layer of the multiple layer substrate, wherein an IC of the plurality of IC is; aligned to substantially overlap a coil of the wireless power coil assembly; and wirelessly powered by the wireless power transmitter control module via the coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A circuit board comprises:
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a multiple layer substrate; a wireless power transmitter control section on a layer of the multiple layer substrate; a wireless power coil assembly fabricated on an inner layer of the multiple layer substrate; an integrated circuit (IC) section on an outer layer of the multiple layer substrate, wherein the IC section substantially overlaps the wireless power coil assembly; and conductive connections that couple the wireless power transmitter control section to the wireless power coil assembly. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification