LED PACKAGE, LED PACKAGE MODULE HAVING THE SAME AND MANUFACTURING METHOD THEREOF, AND HEAD LAMP MODULE HAVING THE SAME AND CONTROL METHOD THEREOF

• US 20110127912A1
• Filed: 11/30/2010
• Published: 06/02/2011
• Est. Priority Date: 11/30/2009
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Hyung Kun, LEE, Young Jin
• Granted Patent: US 8,633,643 B2
• Time in Patent Office: Days
• US Class Current: 315/32
• CPC Class Codes: F21S 41/148 the main emission direction of the LED being perpendicular to the optical axis
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/192 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 45/43 using gas
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10174 Diode
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB

Abstract

Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Claims

1. A light emitting diode package comprising:

a package substrate;

a light emitting diode chip mounted on one surface of the package substrate;

an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and

a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

2. The light emitting diode package of claim 1, further comprising:

a circuit pattern formed on the package substrate and electrically connected to the light emitting diode chip; and

a via which is formed on the package substrate and allows the circuit pattern and the electrode pad to be electrically interconnected.

3. The light emitting diode package of claim 2, wherein the package substrate includes a first substrate and a second substrate layered on the first substrate, the second substrate having the cavity formed therewithin to receive the light emitting diode chip.

4. The light emitting diode package of claim 3, further comprising a glass layer for covering the cavity.

5. The light emitting diode package of claim 3, further comprising a phosphor formed on an upper portion of the light emitting diode chip.

6. The light emitting diode package of claim 1, wherein the light emitting diode chip is plural in number, the light emitting diode chips being electrically interconnected in series to one another.

7. The light emitting diode package of claim 1, wherein the package substrate is made of a material with ceramic.

8. A light emitting diode package module comprising:

a heat radiation substrate, which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit;

a package substrate arranged on the heat radiation substrate;

a heat radiation pad formed on the package substrate to be opposite to the heat radiation unit and bonded to the heat radiation unit;

an electrode pad formed on the package substrate to be opposite to the electrode unit and bonded to the electrode unit; and

a light emitting diode chip mounted on the package substrate and electrically connected to the electrode pad.

9. The light emitting diode package module of claim 8, wherein a surface on which the heat radiation unit faces the heat radiation pad and a surface on which the electrode unit faces the electrode pad are virtually positioned on the same plane.

10. The light emitting diode package module of claim 9, further comprising a conductive adhesive layer interposed between the heat radiation unit and the heat radiation pad, and between the electrode unit and the electrode pad, respectively.

11. The light emitting diode package module of claim 10, wherein surfaces on which the heat radiation unit and the heat radiation pad face to each other have the same size as each other, surfaces on which the electrode unit and the electrode pad face each other have the same size as each other, and the conductive adhesive layer is interposed between the surface on which the heat radiation unit and the heat radiation pad face each other, and between the surface on which the electrode unit and the electrode pad face each other, respectively.

12. The light emitting diode package module of claim 10, wherein the conductive adhesive layer is made of solder.

13. The light emitting diode package module of claim 10, wherein the conductive adhesive layer is made of paste with a buffering material.

14. The light emitting diode package module of claim 8, wherein the heat radiation substrate further comprises an insulating unit interposed between the heat radiation unit and the electrode unit.

15. The light emitting diode package module of claim 14, wherein the heat radiation unit is provided with space unit, the insulating unit is formed within the space unit, and the electrode unit is formed on the insulating unit to be opposite to the electrode pad.

16. The light emitting diode package module of claim 14, wherein the insulating unit is formed on an outer circumferential surface of the heat radiation unit, and the electrode unit is formed on the insulating unit to be opposite to the electrode pad.

17. The light emitting diode package module of claim 8, further comprising an alignment mark formed on the heat radiation substrate in order to determine whether or not the package substrate is aligned with the heat radiation substrate.

18. The light emitting diode package module of claim 8, wherein the heat radiation unit is formed of a material with Cu.

19. The light emitting diode package module of claim 8, wherein the package substrate is formed of a material with ceramic.

20. A head lamp module comprising:

a light emitting diode package module for generating light;

an optical module for changing distribution angle of light generated from the light emitting diode package module;

a light radiation module for emitting heat of the light emitting diode package to the outside; and

a driver module electrically connected to the light emitting diode package module to thereby control operation of the light emitting diode package module,

wherein the light emitting diode package module comprises;

a heat radiation substrate which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit;

a package substrate arranged on the heat radiation substrate;

a heat radiation pad formed on the package substrate to be opposite to the heat radiation unit and bonded to the heat radiation unit;

an electrode pad formed on the package substrate to be opposite to the electrode unit and bonded to the electrode unit; and

a light emitting diode chip mounted on the package substrate and electrically connected to the electrode pad.

21. A method for controlling the head lamp module of claim 20 comprising the steps of:

generating light irradiated toward the optical module by applying light-emission signals to the light emitting diode package module; and

emitting heat of the light emitting diode package module to the outside by applying the light-emission signals according to change of temperature of the light emitting diode package module.

22. A method for manufacturing a light emitting diode package module comprising the steps of:

providing a heat radiation substrate which includes a heat radiation unit made of a conductive material and an electrode unit electrically insulated from the heat radiation unit;

providing a package substrate on which the heat radiation pad and the electrode pad are formed to be opposite to the heat radiation unit and the electrode unit, respectively, and on which the light emitting diode chip is mounted to be electrically connected to the electrode pad; and

mounting the package substrate on the heat radiation substrate through respective bonding between the heat radiation pad and the heat radiation unit, and between the electrode pad and the electrode unit.

23. The method of claim 22, wherein the step of mounting the package substrate is performed by a single process.

24. The method of claim 22, wherein the surface on which the heat radiation unit and the heat radiation pad face each other and the surface on which the electrode unit and the electrode pad face each other are virtually positioned on the same plane.

25. The method of claim 23, wherein the step of mounting the package substrate is performed by interposing a conductive adhesive layer between the heat radiation unit and the heat radiation pad, and between the electrode unit and the electrode pad.

26. The method of claim 24, wherein the surfaces on which the heat radiation unit and the heat radiation pad face each other have the same size as each other, and the surfaces on which the electrode unit and the electrode pad face each other have the same size as each other, and wherein the step of mounting the package substrate is performed by interposing the conductive adhesive layer between the surfaces on which the heat radiation unit and the heat radiation pad face each other, between the surfaces on which the electrode unit and the electrode pad face each other, respectively.

27. The method of claim 24, wherein the conductive adhesive layer is made of solder, and wherein the step of mounting is performed by a surface mounting technology (SMT).

28. The method of claim 24, wherein the conductive adhesive layer is made of paste with a buffering material.

29. The method of claim 22, wherein the heat radiation substrate further comprises an insulating unit interposed between the heat radiation unit and the electrode unit.

30. The method of claim 29, wherein the step of providing the heat radiation substrate comprises the steps of:

forming a space unit on the heat radiation unit;

forming the insulating unit within the space unit; and

forming the electrode unit on the insulating unit to be opposite to the electrode pad.

31. The method of claim 29, wherein the step of providing the heat radiation substrate comprises the steps of:

forming the insulating unit on an outer circumferential surface of the heat radiation unit; and

forming the electrode unit on the insulating unit to be opposite to the electrode pad.

32. The method of claim 22, after the step of mounting the package substrate, further comprising a step of determining whether or not the package substrate is aligned with the heat radiation substrate by using an alignment mark formed on the heat radiation substrate.

33. The method of claim 22, wherein the heat radiation unit is made of a material with Cu.

34. The method of claim 22, wherein the package substrate is made of a material with ceramic.