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GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER

  • US 20110127998A1
  • Filed: 11/30/2009
  • Published: 06/02/2011
  • Est. Priority Date: 11/30/2009
  • Status: Active Grant
First Claim
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1. An integrated circuit comprising:

  • a leadframe;

    a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe;

    a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field substantially perpendicular to the top surface of the die; and

    a non-magnetic material disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

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