GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER
First Claim
1. An integrated circuit comprising:
- a leadframe;
a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe;
a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field substantially perpendicular to the top surface of the die; and
a non-magnetic material disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
1 Assignment
0 Petitions
Accused Products
Abstract
An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
99 Citations
27 Claims
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1. An integrated circuit comprising:
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a leadframe; a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe; a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field substantially perpendicular to the top surface of the die; and a non-magnetic material disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for fabricating an integrated circuit comprising:
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mounting a bottom surface of a die to a leadframe, the die having a top surface and a plurality of perimeter sides and at least one magnetic field sensitive element disposed at the top surface; applying a non-magnetic material along at least a portion of the perimeter sides of the die; encapsulating the die, the non-magnetic material, and at least a portion of the leadframe in a molded magnetic material; and magnetizing the molded magnetic material to form a magnetic field substantially perpendicular to the top surface of the die and such that any lateral magnetic field component of the magnetic field intersects perimeter sides of the die along which the non-magnetic material is disposed. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A magnetic field sensor comprising:
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a ferromagnetic leadframe; a die bonded to the leadframe and having at least a pair of giant magnetoresistive sensor elements disposed on a top surface and spaced apart from one another along an axis; a non-magnetic material disposed at least along perimeter sides of the die which intersect the axis; a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field substantially perpendicular to the top surface, wherein any magnetic field component parallel to the top surface is parallel to the axis; and an isolation layer disposed between the molded magnetic material and the leadframe, the die, and the non-magnetic material which electrically isolates the leadframe, the die, and the non-magnetic material from the molded magnetic material. - View Dependent Claims (23, 24, 25)
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26. A method for fabricating a semiconductor circuit comprising:
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bonding at least a pair of pre-formed strips of non-magnetic material to a leadframe, the pre-formed strips being spaced apart and parallel to one another; bonding a die to the leadframe between the pre-formed strips, the die having at least a pair of magnetoresistive sensor elements disposed on a top surface and spaced apart from one another along an axis, the die positioned such that the axis intersect the pair of pre-formed strips; applying an isolation layer over the die, leadframe, and pre-formed strips; encapsulating the die, the pre-formed strips, and at least a portion of the leadframe in a molded magnetic material, the isolation layer electrically isolating the die, leadframe, and pre-formed strips from the molded magnetic material; and magnetizing the molded magnetic material to form a magnetic field substantially perpendicular to the top surface of the die and such that any magnetic field component parallel to the top surface is parallel to the axis. - View Dependent Claims (27)
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Specification