Thinned-Portion Substrates
First Claim
1. A method of processing a substrate having a first surface, the method comprising:
- forming a cavity in the first surface, the cavity including a lower surface and one or more walls, such that a thinned substrate portion includes the lower surface and a second surface of the substrate opposite to the lower surface;
forming surface structures on the thinned substrate portion; and
detaching the thinned substrate portion after forming the surface structures.
1 Assignment
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Accused Products
Abstract
Thinned-portion substrates and processing of thinned-portion substrates is provided. A portion of a substrate, such as a mother glass used in touch screen manufacturing, can be thinned by forming a cavity in a surface of the substrate. Surface structures, such as touch sensing circuitry and/or display circuitry, can then be formed on the thinned portion of the substrate. For example, touch screen components can be formed as surface structures including touch sensing circuitry and display circuitry on one or more thinned substrate portions through processes including depositing, masking, etching, doping, etc. The thinned substrate portion, including the surface structures formed thereon, can then be detached from the surrounding thicker part of the substrate. In this way, for example, the surrounding thicker part of the substrate can provide structural integrity during various other manufacturing processes, while allowing surface structures to be formed directly on a thinner substrate.
28 Citations
21 Claims
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1. A method of processing a substrate having a first surface, the method comprising:
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forming a cavity in the first surface, the cavity including a lower surface and one or more walls, such that a thinned substrate portion includes the lower surface and a second surface of the substrate opposite to the lower surface; forming surface structures on the thinned substrate portion; and detaching the thinned substrate portion after forming the surface structures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of forming a substrate with surface structures, comprising:
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forming the surface structures on a mother substrate, the mother substrate including a first portion with a first thickness and a second portion with a second thickness less than the first thickness, wherein the surface structures are formed on the second portion; and detaching the second portion from the first portion, the detached second portion being the substrate with the surface structures. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification