Wireless power and wireless communication integrated circuit

• US 20110130093A1
• Filed: 06/03/2010
• Published: 06/02/2011
• Est. Priority Date: 11/30/2009
• Status: Active Grant

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza (Reza), Walley, John, Seshadri, Nambirajan, Karaoguz, Jeyhan, Van Der Lee, Reinier
• Granted Patent: US 9,806,767 B2
• Time in Patent Office: Days
• US Class Current: 455/41.1
• CPC Class Codes: G06K 19/0701 at least one of the integrated circuit chips comprising an arrangement for power management
• CPC Class Codes: G06K 19/0715 the arrangement including means to regulate power transfer to the integrated circuit
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 7/10207 parameter settings related to power consumption of the interrogator
• CPC Class Codes: G06K 7/10346 the antenna being of the far field type, e.g. HF types or dipoles
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: H04L 69/18 Multiprotocol handlers, e.g. single devices capable of handling multiple protocols

Abstract

An integrated circuit (IC) includes a wireless power receive circuit, a wireless communication module, and a circuit module. The wireless power receive circuit generates a supply voltage from a wireless power electromagnetic signal. The wireless communication module converts inter-chip outbound data into an inter-chip outbound wireless signal; transmits the inter-chip outbound wireless signal to another IC; receives an inter-chip inbound wireless signal from the other IC; and converts the inter-chip inbound wireless signal into inter-chip inbound data. The circuit module is powered by the supply voltage and is operable to generate the inter-chip outbound data; and process the inter-chip inbound data.

Claims

1. An integrated circuit (IC) comprises:

a wireless power receive circuit operable to generate a supply voltage from a wireless power electromagnetic signal;

a wireless communication module operable to;

convert inter-chip outbound data into an inter-chip outbound wireless signal;

transmit the inter-chip outbound wireless signal to another IC;

receive an inter-chip inbound wireless signal from the other IC; and

convert the inter-chip inbound wireless signal into inter-chip inbound data; and

a circuit module operably powered by the supply voltage and operable to;

generate the inter-chip outbound data; and

process the inter-chip inbound data.

2. The IC of claim 1, wherein the wireless communication module comprises:

a baseband processing module operable to;

convert the inter-chip outbound data into an inter-chip outbound symbol stream; and

convert an inter-chip inbound symbol stream into the inter-chip inbound data;

a receiver section operable to convert the inter-chip inbound wireless signal into the inter-chip inbound symbol stream;

a transmitter section operable to convert the inter-chip outbound symbol stream into the inter-chip outbound wireless signal; and

an antenna section operable to;

receive an inbound millimeter wave (MMW) signal as the inter-chip inbound wireless signal; and

transmit the inter-chip outbound wireless signal as an outbound MMW signal.

3. The IC of claim 1, wherein the wireless communication module comprises:

a baseband processing module operable to;

convert the inter-chip outbound data into an inter-chip outbound symbol stream; and

convert an inter-chip inbound symbol stream into the inter-chip inbound data;

a receiver section operable to convert the inter-chip inbound wireless signal into the inter-chip inbound symbol stream;

a transmitter section operable to convert the inter-chip outbound symbol stream into the inter-chip outbound wireless signal; and

an coil section operable to;

receive an inbound near field communication (NFC) signal as the inter-chip inbound wireless signal; and

transmit the inter-chip outbound wireless signal as an outbound NFC signal.

4. The IC of claim 3, wherein the coil section comprises:

a coil assembly that generates a wireless power AC voltage based on the wireless power electromagnetic signal, generates an inbound NFC AC voltage from the inbound NFC signal, and generates the outbound NFC signal from an outbound NFC AC voltage;

an NFC inbound driver circuit;

an NFC outbound amplifier circuit;

a wireless power inbound amplifier circuit; and

an isolating circuit operable to isolate the wireless power AC voltage from the inbound and outbound NFC signals to produce an isolated wireless power AC voltage, an isolated inbound NFC signal, and an isolated outbound NFC signal and to provide the isolated wireless power AC voltage from the coil to the wireless power inbound amplifier, to provide the isolated inbound NFC AC voltage from the coil to the NFC inbound driver circuit; and

to provide the isolated outbound NFC signal from the NFC outbound amplifier circuit to the coil.

5. The IC of claim 1 further comprises:

a power management unit operable to manage at least one of;

the voltage produced by the wireless power receive circuit, power consumption by the circuit module, and power consumption by the wireless communication module.

6. The IC of claim 1 further comprises:

a plurality of circuit modules, which includes the circuit module; and

a plurality of wireless communication modules, which includes the wireless communication module, wherein a second wireless communication module of the plurality of wireless communication modules supports intra-chip wireless communications between a first and second circuit modules of the plurality of circuit modules.

7. The IC of claim 1 further comprises:

a processing module operable to;

generate a regulation signal to regulate the supply voltage;

generate wireless power communication data regarding the wireless power electromagnetic signal;

convert the inter-chip outbound data into an inter-chip outbound symbol stream; and

convert an inter-chip inbound symbol stream into the inter-chip inbound data.

8. The IC of claim 1 further comprises:

a waveguide interface for coupling the inter-chip outbound wireless signal and the inter-chip inbound wireless signal to a waveguide of a supporting substrate.

9. An integrated circuit (IC) comprises:

a wireless power receive circuit operable to generate a supply voltage from a wireless power electromagnetic signal;

a processing module operable to;

convert inter-chip outbound data into an inter-chip outbound symbol stream; and

convert an inter-chip inbound symbol stream into inter-chip inbound data;

a receiver section operable to convert an inter-chip inbound millimeter wave (MMW) signal into the inter-chip inbound symbol stream;

a transmitter section operable to convert the inter-chip outbound symbol stream into an inter-chip outbound MMW signal;

an antenna section operable to;

receive the inter-chip inbound MMW signal; and

transmit the inter-chip outbound MMW signal;

a circuit module operably powered by the supply voltage and operable to;

generate the inter-chip outbound data; and

process the inter-chip inbound data.

a die that supports the circuit module, the processing module, the receiver section, the transmitter section, and at least a portion of the wireless power receive circuit; and

a package substrate that supports the die, wherein at least one of the die and the package substrate supports the antenna section.

10. The IC of claim 9, wherein the wireless power receive circuit comprises:

a wireless power receive coil operable to generate an AC voltage from the wireless power electromagnetic signal;

a rectifying circuit operable to generate a rectified voltage from the AC voltage;

a capacitance circuit operable to generate the supply voltage from the rectified voltage;

wherein the processing module is further operable to;

determine a voltage level of the supply voltage;

compare the voltage level to a reference voltage to produce a comparison signal that is used to regulate the supply voltage, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit.

11. The IC of claim 10, wherein the processing module is further operable to:

output the comparison signal such that a transmit wireless power unit adjusts the wireless power electromagnetic signal based on the comparison signal to regulate the power voltage to a desired voltage level.

12. The IC of claim 9 further comprises:

a power management unit operable to manage at least one of;

the voltage produced by the wireless power receive circuit, power consumption by the circuit module, power consumption by the processing module, power consumption by the receiver section, and power consumption by the transmitter section.

13. The IC of claim 9 further comprises:

a plurality of circuit modules, which includes the circuit module; and

the processing module is further operable to;

receive intra-chip outbound data from a first circuit module of the plurality of circuit modules;

convert the intra-chip outbound data into an intra-chip outbound symbol stream;

convert an intra-chip inbound symbol stream into intra-chip inbound data;

output the intra-chip inbound data to the first circuit module;

the receiver section is further operable to convert an intra-chip inbound millimeter wave (MMW) signal into the intra-chip inbound symbol stream;

the transmitter section is further operable to convert the intra-chip outbound symbol stream into an intra-chip outbound MMW signal; and

the antenna section is further operable to;

receive the intra-chip inbound MMW signal from a transmitter section associated with a second circuit module of the plurality of circuit modules; and

transmit the intra-chip outbound MMW signal to a receiver section associated with the second circuit module.

14. The IC of claim 9 further comprises:

a waveguide interface for coupling the inter-chip outbound MMW signal and the inter-chip inbound MMW signal to a waveguide of a supporting substrate.

15. An integrated circuit (IC) comprises:

a wireless power receive circuit operable to generate a supply voltage from a wireless power electromagnetic signal;

a processing module operable to;

convert inter-chip outbound data into an inter-chip outbound symbol stream; and

convert an inter-chip inbound symbol stream into inter-chip inbound data;

a receiver section operable to convert an inter-chip inbound near field communication (NFC) signal into the inter-chip inbound symbol stream;

a transmitter section operable to convert the inter-chip outbound symbol stream into an inter-chip outbound NFC signal; and

an coil section operable to;

receive the inter-chip inbound NFC signal; and

transmit the inter-chip outbound NFC signal;

a circuit module operably powered by the supply voltage and operable to;

generate the inter-chip outbound data; and

process the inter-chip inbound data;

a die that supports the circuit module, the processing module, the receiver section, the transmitter section, and at least a portion of the wireless power receive circuit; and

a package substrate that supports the die, wherein at least one of the die and the package substrate supports the coil section.

16. The IC of claim 15, wherein the wireless power receive circuit comprises:

a wireless power receive coil operable to generate an AC voltage from the wireless power electromagnetic signal;

a rectifying circuit operable to generate a rectified voltage from the AC voltage;

a capacitance circuit operable to generate the supply voltage from the rectified voltage;

wherein the processing module is further operable to;

determine a voltage level of the supply voltage;

compare the voltage level to a reference voltage to produce a comparison signal that is used to regulate the supply voltage, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit.

17. The IC of claim 16, wherein the processing module is further operable to:

output the comparison signal such that a transmit wireless power unit adjusts the wireless power electromagnetic signal based on the comparison signal to regulate the power voltage to a desired voltage level.

18. The IC of claim 15, wherein the coil section comprises:

a coil assembly that generates a wireless power AC voltage based on the wireless power electromagnetic signal, generates an inbound NFC AC voltage from the inbound NFC signal, and generates the outbound NFC signal from an outbound NFC AC voltage;

an NFC inbound driver circuit coupled to the receiver section;

an NFC outbound amplifier circuit coupled to the transmitter section;

a wireless power inbound amplifier circuit coupled to the wireless power receive circuit; and

an isolating circuit operable to isolate the wireless power AC voltage from the inbound and outbound NFC signals to produce an isolated wireless power AC voltage, an isolated inbound NFC signal, and an isolated outbound NFC signal and to provide the isolated wireless power AC voltage from the coil to the wireless power inbound amplifier, to provide the isolated inbound NFC AC voltage from the coil to the NFC inbound driver circuit; and

to provide the isolated outbound NFC signal from the NFC outbound amplifier circuit to the coil.

19. The IC of claim 15 further comprises:

a power management unit operable to manage at least one of;

the voltage produced by the wireless power receive circuit, power consumption by the circuit module, power consumption by the processing module, power consumption by the receiver section, and power consumption by the transmitter section.

20. The IC of claim 15 further comprises:

a plurality of circuit modules, which includes the circuit module; and

the processing module is further operable to;

receive intra-chip outbound data from a first circuit module of the plurality of circuit modules;

convert the intra-chip outbound data into an intra-chip outbound symbol stream;

convert an intra-chip inbound symbol stream into intra-chip inbound data;

output the intra-chip inbound data to the first circuit module;

the receiver section is further operable to convert an intra-chip inbound NFC signal into the intra-chip inbound symbol stream;

the transmitter section is further operable to convert the intra-chip outbound symbol stream into an intra-chip outbound NFC signal; and

the coil section is further operable to;

receive the intra-chip inbound NFC signal from a transmitter section associated with a second circuit module of the plurality of circuit modules; and

transmit the intra-chip outbound NFC signal to a receiver section associated with the second circuit module.