Process for Forming an Isolated Electrically Conductive Contact Through a Metal Package

• US 20110131807A1
• Filed: 02/14/2011
• Published: 06/09/2011
• Est. Priority Date: 05/25/2007
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Nashner, Michael, Howerton, Jeff
• Granted Patent: US 8,117,744 B2
• Time in Patent Office: Days
• US Class Current: 29/852
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove bevelled, chamferred or tapered edge H05K2201/09154
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

Claims

1-20. -20. (canceled)

21. A method of creating an electrically isolated contact comprising:

forming a through via in a metallic substrate wherein the through via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one continuous sidewall extending between the first opening and the second opening;

forming a dielectric sleeve on the at least one sidewall of the via while preserving at least a portion of the through via; and

substantially filling the through via between the top surface and the bottom surface with an electrically conductive material in a single filling step, wherein the electrically conductive material is a conductive ink.

22. The method in claim 21 wherein substantially filling the through via comprises completely filling the through via.

23. A method of creating an electrically isolated contact comprising:

forming a conically shaped through via in a metallic substrate wherein the through via includes a first opening in a top surface of the metallic substrate, a second opening in an opposing bottom surface of the metallic substrate and at least one continuous sidewall extending between the first opening and the second opening;

forming a dielectric sleeve on the at least one sidewall of the through via while preserving at least a portion of the through via; and

completely filling the through via between the top surface and the bottom surface with one electrically conductive material.

24. The method as in claim 23 wherein the first opening has a diameter between 90 to 200 micrometers and the second end has a diameter between 20 to 50 micrometers.

25. The method of claim 23 wherein the electrically conductive material is a conductive ink.