Cleaning a Hot Soldering Iron Tip Using Dry Melamine Sponge

• US 20110132399A1
• Filed: 12/10/2010
• Published: 06/09/2011
• Est. Priority Date: 04/29/2005
• Status: Active Grant

• Current Assignee: Sukhvinder Singh Dhanjal
• Original Assignee: Sukhvinder Singh Dhanjal
• Inventors: DHANJAL, Sukhvinder Singh
• Granted Patent: US 8,109,430 B2
• Time in Patent Office: Days
• US Class Current: 134/6
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/249978 Voids specified as micro

Abstract

In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Claims

1-5. -5. (canceled)

6. A method of cleaning molten solder from the hot tip of a soldering iron without using water, comprising:

providing dry open-celled melamine foam; and

,

wiping the hot tip of the soldering iron against the foam.

7. The method of claim 6 in which:

the method comprises the preliminary step of forming the foam into a block with a through-hole inclined relative to vertical in the block; and

,

the wiping comprises locating the hot tip at an upper end of the through-hole and then contacting the hot tip against the foam surrounding the through-hole.

8. The method of claim 6 comprising the preliminary steps of:

shaping the foam into a block with an inclined forward surface in an upper portion of the block, an inclined rear surface in an lower portion of the block parallel to the forward surface, and a through-hole extending between the forward and rear surfaces; and

,

placing the block in a receptacle that cooperates with the rear surface to define a cavity for receiving molten solder.

12. The method of claim 6 further comprising applying heat to at least a first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam.

13. The method of claim 6 further comprising applying heat and compression to at least a first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam.

14. The method of claim 12 wherein the step of applying heat to at least the first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam is performed before wiping the hot tip of the soldering iron against the foam.

15. The method of the claim 13 wherein the step of applying heat and compression to at least the first portion of the dry open-celled melamine foam such that the first portion of the block of open-celled melamine foam is at least partially more rigid than a second portion of the block of open-celled melamine foam is performed before wiping the hot tip of the soldering iron against the foam.

9-11. -11. (canceled)